A3P600-1FGG484I vs A3P600-FG484 Comparaison
Comparaison détaillée côte à côte de A3P600-1FGG484I par Microchip Technology et A3P600-FG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3P600-1FGG484I - 600K Gate Flash FPGA 235 I/O | Microchip
A3P600-1FGG484I ✓ ActifMicrochip Technology
A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip
A3P600-FG484 ✓ ActifComparaison des spécifications
| Paramètre | A3P600-1FGG484I | A3P600-FG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $79,60 | $56,30 |
| Family | ProASIC3 | ProASIC3 (Flash FPGAs) |
| System Gates | 600000 | — |
| VersaTiles (D-flip-flops) | 13824 | — |
| User I/Os | 235 | — |
| Boîtier | 484-ball FBGA (FGG484) | 484-pin FBGA, 23x23 mm |
| Speed Grade | -1 | — |
| Core Voltage | 1.5 V | — |
| Technology | 130 nm flash process | — |
| Logic Architecture | VersaTile (LUT / D-flip-flop / latch) | — |
| Configuration Memory | On-chip flash (nonvolatile, single chip) | On-chip flash (non-volatile, instant-on) |
| System Performance | Up to approx. 231 MHz (per Utmel family comparison) | 231 MHz |
| I/O Banks | 4 (A3P600 per Microchip migration note) | — |
| Température de fonctionnement | Industrial (-40C to +100C), I suffix | 0C to +85C (TJ) |
| Type de montage | Surface Mount | Surface Mount |
| Reprogrammability | Live reprogrammable (in-system) | — |
| Number of Dedicated RAM Blocks | [DATA_NEEDED: embedded memory blocks] | — |
| Max User Flash Memory | [DATA_NEEDED: embedded flash capacity] | — |
| DLL/PLL Resources | [DATA_NEEDED: clock conditioning resources] | — |
| Total Gates | — | 600000 gates |
| Number of Registers | — | 13824 |
| VersaTiles (Logic Elements) | — | 13824 |
| Maximum User I/O | — | 235 I/O |
| Process Technology | — | 130 nm, 7-layer metal flash |
| Core Supply Voltage | — | 1.425 V to 1.575 V |
| Embedded Memory | — | Embedded block SRAM (18 kbit blocks) |
| Soft Processor Support | — | ARM Cortex-M1 (optional soft core) |
| Statut RoHS | — | RoHS3 Compliant (lead-free per FGG variant) |
| Packaging | — | Tray |
| Programming | — | In-system programmable via JTAG, no external boot device |