A3P600-2FG256I vs A3P600-2FGG256 Vergleich
Detaillierter Direktvergleich von A3P600-2FG256I von Microchip Technology und A3P600-2FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip
A3P600-2FG256I ✓ AktivMicrochip Technology
A3P600-2FGG256 - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-2FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | A3P600-2FG256I | A3P600-2FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $44,40 | $50,51 |
| Manufacturer Series | ProASIC3 (A3P600) | — |
| Logic Elements (LEs) | 7K LEs (approximately) | — |
| Configuration Memory | 110592 bits (flash, non-volatile) | On-chip flash (nonvolatile, single chip) |
| Number of I/Os | 177 I/O | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Speed Grade | -2 | -2 |
| Temperature Range | -40C to +85C (industrial, suffix I) | — |
| Gehäuse | 256-FBGA (LBGA) | 256-LBGA / 256-FBGA |
| Montagestil | SMD/SMT | — |
| Configuration Technology | Flash (single-chip, no external PROM) | — |
| Reprogrammability | Yes (in-system reprogrammable) | — |
| Power-up Behavior | Live at power-up (instant-on) | — |
| I/O Banks | 4 I/O banks with dedicated VCCIBx supplies | 4 |
| Logic Architecture | VersaTile (3-input LUT / D-FF / latch with enable) | — |
| RoHS-Status | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Family | — | ProASIC3 |
| System Gates | — | 600K |
| Logic Elements | — | VersaTiles (ProASIC3 fabric) |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 177 |
| Maximum System Frequency | — | 310 MHz |
| Process Technology | — | 130 nm flash |
| Montageart | — | Surface Mount |
| Terminal Form | — | Ball (BGA), square package |
| Temperature Grading | — | Commercial [DATA_NEEDED: exact operating temperature range] |