A3P600-2FG256I vs A3P600-2FGG256 Comparación
Comparación detallada lado a lado de A3P600-2FG256I por Microchip Technology y A3P600-2FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip
A3P600-2FG256I ✓ ActivoMicrochip Technology
A3P600-2FGG256 - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-2FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | A3P600-2FG256I | A3P600-2FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $44,40 | $50,51 |
| Manufacturer Series | ProASIC3 (A3P600) | — |
| Logic Elements (LEs) | 7K LEs (approximately) | — |
| Configuration Memory | 110592 bits (flash, non-volatile) | On-chip flash (nonvolatile, single chip) |
| Number of I/Os | 177 I/O | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Speed Grade | -2 | -2 |
| Temperature Range | -40C to +85C (industrial, suffix I) | — |
| Encapsulado | 256-FBGA (LBGA) | 256-LBGA / 256-FBGA |
| Estilo de montaje | SMD/SMT | — |
| Configuration Technology | Flash (single-chip, no external PROM) | — |
| Reprogrammability | Yes (in-system reprogrammable) | — |
| Power-up Behavior | Live at power-up (instant-on) | — |
| I/O Banks | 4 I/O banks with dedicated VCCIBx supplies | 4 |
| Logic Architecture | VersaTile (3-input LUT / D-FF / latch with enable) | — |
| Estado RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Family | — | ProASIC3 |
| System Gates | — | 600K |
| Logic Elements | — | VersaTiles (ProASIC3 fabric) |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 177 |
| Maximum System Frequency | — | 310 MHz |
| Process Technology | — | 130 nm flash |
| Tipo de montaje | — | Surface Mount |
| Terminal Form | — | Ball (BGA), square package |
| Temperature Grading | — | Commercial [DATA_NEEDED: exact operating temperature range] |