A3P600-2FGG144 vs A3P400-2FGG144 Vergleich
Detaillierter Direktvergleich von A3P600-2FGG144 von Microsemi und A3P400-2FGG144 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | A3P600-2FGG144 | A3P400-2FGG144 |
|---|---|---|
| Marke | Microsemi | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $30,40 | $40,20 |
| Family | ProASIC3 | ProASIC3 |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm, 7-layer metal (6 copper) CMOS |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| Gehäuse | 144-Ball FBGA (FGG144) | 144-LBGA (FGG144) |
| Ball Pitch | 1 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Speed Grade | -2 | -2 |
| Configuration | Single-chip, Instant On, no external boot device | Single-chip, no external boot ROM |
| I/O Banks | 4 (independently supplied VCCIB banks) | 4 (independent VCCIBx supplies) |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Lead free (per Kynix listing) |
| System Gates | — | 403000 |
| User I/Os | — | 97 |
| Embedded SRAM | — | 55296 bits (true dual-port) |
| Programming Technology | — | Nonvolatile Flash |
| Live at Power-Up | — | LAPU Level 0 |
| Soft Processor Support | — | Optional soft ARM support |
| Reprogrammability | — | Yes (in-system reprogrammable flash) |
| Versorgungsspannung | — | [DATA_NEEDED: core supply voltage] |