A3P600-2FGG144 - 600K Gate Flash FPGA 144-FBGA | Microchip
Teilenummer: A3P600-2FGG144 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $39.8 | $398,00 |
| 100 | $36.2 | $3.620,00 |
| 500 | $33.1 | $16.550,00 |
| 1.000 | $30.4 | $30.400,00 |
A3P600-2FGG144 Übersicht
A flash FPGA is a programmable logic device that stores its configuration in on-chip nonvolatile flash memory rather than the volatile SRAM used by most mainstream FPGA families. Because the configuration is retained when power is removed, flash FPGAs power up instantly (Instant On), typically need no external configuration PROM or microcontroller for bitstream loading, and offer a single-chip solution with a smaller bill of materials within the broader hierarchy of programmable logic: FPGA -> flash FPGA -> ProASIC3 family -> A3P600 device.
Key features of the A3P600 include nonvolatile flash fabric for security and instant-on operation, reprogrammability with no external boot device, low total cost of ownership (TOC), four I/O banks with independently supplied VCCIB rails supporting multiple voltage standards, and VersaTile architecture in which each tile can act as a three-input LUT, a D-flip-flop with enable, or a latch, maximizing fabric efficiency. The optional Soft ARM support in the ProASIC3 family allows embedded processor integration.
Technically, the ProASIC3 third-generation flash architecture builds on the ProASICPLUS family, delivering higher density, higher performance, and lower power. Because the fabric is flash-based, there is no configuration data stream to intercept, improving design security versus SRAM FPGAs, and static power consumption is reduced since no SRAM configuration cells are held in every routing node.
Typical applications include industrial control, secure embedded systems, bridge and interface logic, portable and low-power equipment, and ASIC prototyping where a single-chip, boot-free solution shortens time to market.
When designing, note that I/O banks are supplied by dedicated VCCIBx pins: only I/O standards with compatible voltages may share a bank, and package VCCIBx pins route through the corresponding banks per the Microchip migration application note.
This page synthesizes distributor sourcing channels, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3P600-2FGG144 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P600-2FGG144 (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Operating Temperature, Process Technology, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P600-2FGG144I
✅ Drop-In✓ Auf Lager
$44.6 / Stück
Datenblatt ansehen →A3P600L-1FGG144
✅ Drop-In✓ Auf Lager
$29.4 / Stück
Datenblatt ansehen →A3P1000-2FGG144I
✅ Drop-In✓ Auf Lager
$27.2 / Stück
Datenblatt ansehen →A3P1000-1FGG144T
✅ Drop-In✓ Auf Lager
$75 / Stück
Datenblatt ansehen →A3P600-2FGG144 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| Equivalent Gate Count | 600000 gates |
| Logic Cells (CLBs) | 13824 CLBs |
| User I/O | 97 I/O |
| System Performance | 310 MHz |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Program Technology | Nonvolatile Flash |
| Gehäuse | 144-Ball FBGA (FGG144) |
| Ball Pitch | 1 mm |
| Montageart | Surface Mount |
| Packaging | Tray |
| Speed Grade | -2 |
| Configuration | Single-chip, Instant On, no external boot device |
| I/O Banks | 4 (independently supplied VCCIB banks) |
A3P600-2FGG144 144-ball fbga (fgg144) Pinbelegungsleitfaden
Pinbelegung für A3P600-2FGG144 (144-ball fbga (fgg144)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P600-2FGG144.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P600-2FGG144 ist geeignet für 6 Anwendungs: Industrial Control and Automation, Secure Embedded Systems, Bridge and Interface Logic, Portable and Low-Power Equipment, ASIC Prototyping and Low-Volume Production, Aerospace and Defense Board-Level Logic.
Industrial Control and Automation
The A3P600-2FGG144 fits industrial control because its 97 user I/Os are organized into four independently supplied VCCIB banks, letting one chip interface 3.3V, 2.5V, and 1.8V logic domains typical of PLC I/O racks and motor-drive controllers without level-shifters. Its 310 MHz system performance handles real-time sequencing, encoder processing, and protocol bridging in deterministic control loops. The nonvolatile flash fabric powers up Instant On - the controller is functional within milliseconds of board power-up, with no boot FPGA or configuration PROM to fail in the field. Because the configuration lives in flash rather than SRAM, it is also resistant to bitstream readout, protecting proprietary control IP. Use the industrial-grade A3P600-2FGG144I variant (same footprint) for extended temperature cabinets.
Empfohlen
Secure Embedded Systems
Flash-based configuration is the core reason the A3P600-2FGG144 suits secure embedded designs: unlike SRAM FPGAs that stream a bitstream from external memory at every power-up, the ProASIC3 fabric holds its configuration in on-chip flash, eliminating the interceptable configuration data path entirely. The 600K-gate capacity accommodates encryption wrappers, authentication state machines, and secure boot glue logic around host processors, while the single-chip solution removes the configuration device from the bill of materials - one less component to counterfeit or probe. The 144-ball 1mm-pitch FBGA keeps the secure logic physically compact. Pair it with Microchip flash MCUs for the root-of-trust chain.
Empfohlen
Bridge and Interface Logic
As glue logic between mismatched buses, the A3P600-2FGG144 provides 13,824 VersaTiles - each usable as a 3-input LUT or a D-flip-flop with enable - which is ample for implementing bus width converters, memory controllers, and legacy interface translators such as parallel-to-serial bridges. The four I/O banks with per-bank VCCIB supplies directly support the mixed-voltage reality of bridge designs: only I/O standards with compatible voltages share a bank, per Microchip's migration application note, and package VCCIBx pins route through their corresponding banks. The -2 speed grade's 310 MHz system performance comfortably covers 100 MHz-class interface clocks with timing margin.
Empfohlen
Portable and Low-Power Equipment
Battery-powered instruments benefit from the A3P600-2FGG144's 130nm flash fabric, which eliminates the per-routing-node SRAM configuration cells that dominate static power in SRAM FPGAs, and from the 1.5V core rail that reduces dynamic energy per transition. For designs where static power is the dominant budget item, substitute the pin-compatible A3P600L-1FGG144 low-power variant on the identical FGG144 footprint. The Instant On, single-chip configuration also suits portable equipment: no configuration storage to drain standby current, and the FPGA is usable immediately for power-rail sequencing or power-good logic during system startup.
Empfohlen
ASIC Prototyping and Low-Volume Production
The ProASIC3 family was positioned by Microchip as a route to ASIC-level unit cost with FPGA time-to-market benefits, making the A3P600-2FGG144 a practical vehicle for ASIC algorithm validation and low-volume production where mask costs are unjustifiable. The 600K-gate fabric with reprogrammable flash supports multiple design iterations on the same board, and the VersaTile architecture (LUT or flip-flop per tile) maps ASIC-synthesized netlists efficiently. When the prototype outgrows 600K gates, Microchip's migration application note documents moving designs from higher-density ProASIC3 devices down and across - the A3P1000 in the same FGG144 footprint allows a solder-in density upgrade.
Empfohlen
Aerospace and Defense Board-Level Logic
Microsemi (now Microchip) built its FPGA reputation in aerospace and defense, and the A3P600-2FGG144's flash fabric brings two properties valued there: configuration immunity to radiation-induced configuration upsets compared with SRAM cells, and instant-on operation for systems that must be functional at power application with no configuration latency. The nonvolatile configuration also simplifies conformance because there is no external bitstream storage to certify. For flight programs requiring formal qualification flows, evaluate the Automotive ProASIC 3 family (datasheet DS50003485), which shares the same core tile architecture - three-input LUT or D-flip-flop with enable per VersaTile - with automotive-grade processing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P600-2FGG144 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P600-2FGG144I | A3P600L-1FGG144 | A3P1000-2FGG144I | A3P1000-1FGG144T |
|---|---|---|---|---|---|
| Package | 144-Ball FBGA (FGG144), 1 mm pitch | 144-Ball FBGA (FGG144) - same | 144-Ball FBGA (FGG144) - same | 144-Ball FBGA (FGG144) - same | 144-Ball FBGA (FGG144) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gate Count | 600,000 gates | 600,000 gates | 600,000 gates | 1,000,000 gates | 1,000,000 gates |
| Speed Grade | -2 | -2 | -1 | -2 | -1 |
| Temperature Grade | Commercial | Industrial | Commercial | Industrial | Commercial (T suffix) |
| Configuration Technology | Nonvolatile flash, Instant On | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
Wichtigste Unterscheidungsmerkmale
- Commercial grade at lowest cost within the FGG144 600K group (vs. A3P600-2FGG144I)
- Full -2 speed grade versus low-power variant (vs. A3P600L-1FGG144)
- Right-sized density on a shared footprint (vs. A3P1000-2FGG144I)
Designhinweise
Bank planning is a power and architecture decision: the A3P600 provides four I/O banks, each with dedicated VCCIBx supply pins, and per the Microchip migration application note, package VCCIBx pins are routed through the corresponding banks of the device - only I/O standards with compatible voltage levels may be assigned to the same bank. Before layout, group your I/O by voltage standard in Libero SoC and confirm each bank's VCCIB rail; mixing a 3.3V LVCMOS bank with a 1.8V standard in one bank risks overstress. The 1.5V core rail should be decoupled with low-ESR ceramics placed near the ball grid.
A frequent mistake when substituting within ProASIC3 is ignoring the L-suffix: the A3P600L-1FGG144 is pin-compatible with the A3P600-2FGG144 but pairs the low-power die with the slower -1 speed grade. A design that closes timing at -2 may fail static timing analysis on the L part. Likewise, density migrations between A3P600 and A3P1000 require re-running place-and-route because fabric resource maps differ, even on the same FGG144 package. Always re-verify timing and pin constraints in Libero SoC after any device-grade change.
The 144-ball FGG144 uses a 1mm ball pitch, which is comfortably routable on a standard 4-layer PCB with 0.2mm via-in-pad or dog-bone escape on the perimeter rows; plan inner-row escape channels early because the 12x12 grid concentrates VCC/GND balls centrally. Since the flash fabric is Instant On, add series termination on fast I/O banks to control first-cycle signal integrity, and reserve test points on JTAG/programming balls for in-system reprogramming without full board removal.
Compliance-Informationen
RoHS/REACH status not stated in the verified data retrieved for this ordering code; a separate Automotive ProASIC 3 family (datasheet DS50003485) exists for automotive-grade requirements. Request certificate of conformance with RFQ.
