A3P600-2FGG144 vs A3P600-1FGG144I Vergleich
Detaillierter Direktvergleich von A3P600-2FGG144 von Microsemi und A3P600-1FGG144I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P600-1FGG144I - ProASIC3 FPGA, 600K Gates | Microchip
A3P600-1FGG144I ✓ AktivSpezifikationsvergleich
| Parameter | A3P600-2FGG144 | A3P600-1FGG144I |
|---|---|---|
| Marke | Microsemi | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $30,40 | $45,00 |
| Family | ProASIC3 | ProASIC3 |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| Gehäuse | 144-Ball FBGA (FGG144) | 144-LBGA (13x13 mm, 0.8 mm pitch) |
| Ball Pitch | 1 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Speed Grade | -2 | — |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| System Gates | — | 600000 |
| Logic Elements (LEs) | — | 13824 |
| D-Flip-Flops | — | 13824 |
| RAM Bits | — | 110592 |
| User I/Os | — | 97 |
| Number of PLLs | — | 1 |
| Core Supply Voltage | — | 1.5 V |
| I/O Standards Supported | — | 3.3V, 2.5V, 1.8V, 1.5V |
| Maximum System Performance | — | 272 MHz |
| Maximum Internal Clock Frequency | — | 350 MHz |
| Betriebstemperaturbereich | — | -40°C to +100°C (industrial) |
| Technology | — | 130nm Flash |