A3P600-FG256I vs A3P600-FGG256I Vergleich
Detaillierter Direktvergleich von A3P600-FG256I von Microchip Technology und A3P600-FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P600-FG256I - ProASIC3 FPGA, 600K Gates | Microchip Technology
A3P600-FG256I ✓ AktivMicrochip Technology
A3P600-FGG256I - ProASIC3 Flash FPGA 600K Gates | Microchip
A3P600-FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | A3P600-FG256I | A3P600-FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,10 | $96,23 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | ProASIC3 | — |
| System Gates | 600,000 | 600K |
| Logic Elements / VersaTiles | 13,824 VersaTiles (7K logic elements per Mouser) | — |
| Total RAM Bits | 110,592 | — |
| Number of User I/O | 177 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Maximum Internal Frequency | [DATA_NEEDED: accurate maximum frequency; distributor listings cite 231 MHz or 350 MHz] | — |
| Gehäuse | 256-LBGA (FBGA-256) | 256-Ball FBGA (FGG256) |
| Package Dimensions | 17 x 17 mm, 1.6 mm height, 1 mm pitch | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperaturbereich | [DATA_NEEDED: exact industrial temperature range (I suffix)] | — |
| Programming Technology | Nonvolatile Flash | — |
| Reprogrammability | In-system programmable | — |
| I/O Supply Voltage Range | [DATA_NEEDED: exact I/O bank voltage range] | — |
| RoHS-Status | unknown | Compliant |
| REACH Status | unknown | — |
| Lebenszyklusstatus | active per DigiKey (ships today) | — |
| Family | — | ProASIC3 |
| Logic Elements (D-Registers) | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 177 |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm |
| I/O Banks | — | 4 |
| Configuration Technology | — | Flash (nonvolatile, single-chip) |
| Betriebstemperatur | — | -40C to +85C |
| Lead-Free | — | Yes |
| Typical Applications | — | Signal processing, industrial automation, communications, hardware acceleration |