A3P600-FGG256I - ProASIC3 Flash FPGA 600K Gates | Microchip
Teilenummer: A3P600-FGG256I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $148.5 | $148,50 |
| 10 | $133.65 | $1.336,50 |
| 100 | $119.1 | $11.910,00 |
| 500 | $106.92 | $53.460,00 |
| 1.000 | $96.23 | $96.230,00 |
A3P600-FGG256I Übersicht
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than SRAM, allowing single-chip, instant-on operation without an external configuration device. Within the programmable logic hierarchy, the A3P600 sits in the mid-density tier of the ProASIC3 family, above the A3P400 and below the A3P1000.
Key features include nonvolatile flash programming that eliminates the boot-time and security exposure of SRAM FPGAs, four I/O banks with independently configurable VCCIBx supplies supporting mixed-voltage systems, 1.5V core operation for low dynamic power, and reprogrammability for in-field updates. Low total cost of ownership (TOC) is a stated family pillar on the Microchip product page.
Architecturally, ProASIC3 uses a sea-of-gates fabric of versatile logic elements and embedded flash switches, delivering deterministic, ASIC-like security because the bitstream is stored invisibly in flash and cannot be read back. The 130nm process balances density, cost, and power, while the 231 MHz ceiling supports real-time signal processing and glue-logic consolidation.
Typical applications include industrial automation controllers, communications line cards, real-time signal processing, custom hardware acceleration, and secure single-chip logic replacement in aerospace-adjacent industrial systems, where instant-on startup and configuration security are decisive.
A key design consideration: assign I/O standards with compatible voltage levels to the same VCCIBx bank, because bank supplies are dedicated and cannot be mixed within a bank, per Microchip migration application notes.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing information gain for engineers evaluating the ProASIC3 family.
Drop-in-Alternativen für A3P600-FGG256I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P600-FGG256I (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Operating Temperature, RoHS Status, System Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P600-2FGG256I
✅ Drop-In✓ Auf Lager
$49.8 / Stück
Datenblatt ansehen →A3P600-2FGG256
✅ Drop-In✓ Auf Lager
$50.51 / Stück
Datenblatt ansehen →A3P600-FGG256
✅ Drop-In✓ Auf Lager
$15.4 / Stück
Datenblatt ansehen →A3P600-FG256I
✅ Drop-In✓ Auf Lager
$23.1 / Stück
Datenblatt ansehen →A3P600-FGG256Y
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P600-FGG256II
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P600-FGG256I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements (D-Registers) | 13824 |
| Embedded RAM | 110592 bits |
| User I/O | 177 |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| I/O Banks | 4 |
| Configuration Technology | Flash (nonvolatile, single-chip) |
| Betriebstemperatur | -40C to +85C |
| Gehäuse | 256-Ball FBGA (FGG256) |
| Montageart | Surface Mount |
| Lead-Free | Yes |
| RoHS-Status | Compliant |
| Typical Applications | Signal processing, industrial automation, communications, hardware acceleration |
A3P600-FGG256I 256-ball fbga (fgg256) Pinbelegungsleitfaden
Pinbelegung für A3P600-FGG256I (256-ball fbga (fgg256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P600-FGG256I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P600-FGG256I ist geeignet für 6 Anwendungs: Industrial Automation Control, Real-Time Signal Processing, Secure Single-Chip Logic, Communications Line Cards, Custom Hardware Acceleration, Legacy Logic Migration and Obsolescence Buffering.
Industrial Automation Control
The A3P600-FGG256I fits industrial automation because its -40C to +85C industrial rating, 177 user I/Os, and instant-on flash configuration meet the environmental and startup demands of PLCs, motor control interfaces, and sensor aggregation nodes. In a typical controller, the FPGA implements deterministic state machines, encoder interfaces, and fieldbus glue logic at the 231 MHz system ceiling while a host microcontroller runs protocol stacks. Because configuration resides in on-chip flash, machinery is logic-ready the moment power is applied - no configuration device boot delay. The four independent VCCIBx banks let designers mix 3.3V, 2.5V, and 1.8V I/O standards on one chip, consolidating legacy glue logic and reducing BOM count in retrofit industrial designs.
Empfohlen
Real-Time Signal Processing
For real-time signal processing, the A3P600-FGG256I provides 13,824 registers and 110,592 bits of embedded RAM - enough for FIR filters, decimation chains, and parallel datapaths at up to 231 MHz on the 130nm fabric. The 177 user I/Os support wide parallel ADC/DAC interfaces, and the flash fabric delivers deterministic, single-cycle routing behavior without configuration-load latency, which matters for systems that must capture data immediately after power-up. Designers typically place this FPGA between high-speed converters and a DSP or MCU, using the four I/O banks to match converter logic standards independently. The trade-off versus modern SRAM FPGAs is lower raw throughput, so target applications below roughly 200 MHz clock rates where security and instant-on outweigh peak performance.
Empfohlen
Secure Single-Chip Logic
The A3P600-FGG256I is well suited to designs where configuration security is a requirement: ProASIC3 stores the bitstream in on-chip flash cells that cannot be read back, unlike SRAM FPGAs whose bitstream travels over a visible bus at every power-up. This makes the device appropriate for proprietary industrial equipment, licensed peripherals, and defense-adjacent commercial systems needing anti-cloning protection. Because no external configuration flash is required, the bill of materials shrinks and the attack surface narrows. The 600K-gate capacity consolidates custom acceleration, bus bridges, and authentication logic onto the single chip. Designers should still follow Microchip security application guidance for JTAG access control in production units to complete the security posture.
Empfohlen
Communications Line Cards
In communications equipment, the A3P600-FGG256I serves as line-card glue logic, framing logic, and interface bridging between backplane standards. The four independently supplied I/O banks accept different voltage standards per bank, matching legacy 3.3V backplanes to modern 1.8V Serdes-adjacent circuitry on one device, as documented in Microchip bank-routing application notes. The 110,592-bit embedded RAM supports FIFO buffering and elastic stores, while 13,824 registers implement framers, counters, and scramblers at line rates within the 231 MHz limit. Flash configuration guarantees the card is link-ready instantly after hot-swap power application, and in-field reprogrammability supports firmware-defined protocol updates without board revision.
Empfohlen
Custom Hardware Acceleration
The A3P600-FGG256I offloads compute kernels from host processors as custom hardware acceleration: CRC engines, encryption primitives, checksum calculators, and parallel arithmetic pipelines fit within 600K system gates and run deterministically at up to 231 MHz. The 110,592-bit RAM array provides local coefficient and buffer storage with deterministic access latency, valuable for real-time loops. Compared with a software-only solution, the FPGA achieves order-of-magnitude speedups on bit-parallel operations; compared with larger SRAM FPGAs, it offers lower power at 1.5V core, instant-on startup, and configuration security at lower cost. Designers should budget floorplanning effort since 130nm routing is less dense than modern fabrics.
Empfohlen
Legacy Logic Migration and Obsolescence Buffering
The A3P600-FGG256I is a strong vehicle for migrating obsolete ASIC, PLD, and mature FPGA logic into a current-production, single-chip solution. Microchip positions ProASIC3 on low total cost of ownership, and the 600K-gate capacity plus 177 I/Os comfortably absorb multiple legacy 22V10, ispLSI, or older FPGA devices. The 256-ball FBGA footprint remains in active production, mitigating further obsolescence risk, and the industrial -40C to +85C grade matches the environments of legacy defense and industrial equipment being redesigned. Because the fabric is flash-based and reprogrammable, late bug fixes do not require board changes. Migration teams should verify bank voltage mapping against the original design before assigning I/Os.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P600-FGG256I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P600-2FGG256I | A3P600-FGG256 | A3P600-FG256I |
|---|---|---|---|---|
| Package | 256-Ball FBGA (FGG256) | 256-Ball FBGA (FGG256) - same | 256-Ball FBGA (FGG256) - same | 256-Ball FBGA (FG256) - same footprint |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K |
| User I/O | 177 | 177 | 177 | 177 |
| Max Frequency | 231 MHz | Higher than 231 MHz (speed grade 2) | 231 MHz | 231 MHz |
| Embedded RAM | 110592 bits | 110592 bits | 110592 bits | 110592 bits |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration | On-chip flash, single-chip, secure | On-chip flash | On-chip flash | On-chip flash |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature qualification (vs. A3P600-FGG256)
- Faster timing headroom at same footprint (vs. A3P600-2FGG256I)
- Single-chip secure configuration (vs. Xilinx Spartan-3 class SRAM FPGAs)
Designhinweise
The A3P600-FGG256I requires a 1.5V core supply plus up to four separate VCCIBx bank supplies. Per the Microchip migration application note (a3p1000_migration_hbs.pdf), the four I/O banks in A3P600 have dedicated VCCIBx supplies, and only I/Os with compatible voltage standards may share a bank. Plan a power tree that generates each bank voltage independently - do not tie banks of mixed standards to a single rail. Decouple each supply with bulk plus high-frequency ceramics placed at the ball-via escape region.
The 256-ball FBGA with 177 user I/Os demands careful fanout. Use via-in-pad or dog-bone escapes with at least one internal signal layer dedicated to breakout, and reserve two planes for the 1.5V core and bank I/O supplies. Keep JTAG (TCX/TDI/TMS/TDO) traces short with a series resistor on TCK for signal integrity during in-system programming. Confirm ball map coordinates against the ProASIC3 datasheet package table before routing - never copy layouts between FG and FGG variants without verifying plating-related pad definitions.
A frequent mistake is substituting a commercial-temperature variant (e.g., A3P600-FGG256, 0C to +70C) into an industrial design requiring -40C to +85C; verify the full suffix including the I grade before release. Also, do not assume cross-brand pin compatibility - Xilinx/Altera 256-ball parts are not footprint-compatible despite similar capacity. Finally, remember flash FPGAs power up configured: ensure I/O states at t=0 are benign for attached circuitry, since there is no configuration-load window to rely on.
Compliance-Informationen
Datasheets.com lists the A3P600-FGG256I as lead-free FBGA and RoHS compliant. The FGG suffix denotes Pb-free plating per Microchip package nomenclature.
