A3PE1500-1FGG484 vs A3PE1500-1FGG48C Vergleich

Detaillierter Direktvergleich von A3PE1500-1FGG484 von Microchip Technology und A3PE1500-1FGG48C von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE1500-1FGG484 A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip

A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip

A3PE1500-1FGG484 ✓ Aktiv
Microchip Technology
A3PE1500-1FGG48C A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip

A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip

A3PE1500-1FGG48C ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE1500-1FGG484 A3PE1500-1FGG48C
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $48,10 $43,10
Family ProASIC3E ProASIC3E Flash FPGA
System Gates 1,500,000 (1.5M) 1,000,000
Fabric Cells / Logic Capacity 276,480 —
Logic Cells 38,400 —
User I/Os (this package) 280 —
Max User I/Os (family) 616 —
Embedded SRAM Up to 504 kbits true dual-port [DATA_NEEDED: Embedded SRAM capacity]
Process Technology 130-nm, 7-layer metal (6 copper), flash-based CMOS —
Core Supply Voltage 1.5 V [DATA_NEEDED: Core Supply Voltage]
Configuration Memory On-chip flash (live-at-power-up, single-chip) —
Speed Grade -1 (standard) -1
Betriebstemperatur 0C to +70C (commercial) [DATA_NEEDED: Operating Temperature range]
Gehäuse 484-ball FBGA (FGG484), 1.00 mm pitch 484-Ball FBGA (FGG484)
Montageart Surface Mount Surface Mount
Packaging Tray —
Maximale Taktfrequenz [DATA_NEEDED: maximum clock frequency] —
RoHS-Status [DATA_NEEDED: RoHS status] —
User I/O — 280
Configuration Capacity — 276,480 bits
Temperature Grade — C (Commercial)
Technology — Nonvolatile Flash
Reprogrammable — Yes
Soft ARM Support — Optional
Instant On — Yes (no external boot flash)
RoHS — Compliant (G suffix)
Package Footprint Compatibility — FG256 and FG484 footprint-compatible
VREF Requirement — One voltage-referenced I/O per minibank for voltage-referenced standards

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