A3PE1500-1FGG484 vs A3PE1500-1FGG48C Comparação

Comparação detalhada lado a lado de A3PE1500-1FGG484 por Microchip Technology e A3PE1500-1FGG48C por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
A3PE1500-1FGG484 A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip

A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip

A3PE1500-1FGG484 ✓ Ativo
Microchip Technology
A3PE1500-1FGG48C A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip

A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip

A3PE1500-1FGG48C ✓ Ativo

Comparação de especificações

Parâmetro A3PE1500-1FGG484 A3PE1500-1FGG48C
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $48,10 $43,10
Family ProASIC3E ProASIC3E Flash FPGA
System Gates 1,500,000 (1.5M) 1,000,000
Fabric Cells / Logic Capacity 276,480 —
Logic Cells 38,400 —
User I/Os (this package) 280 —
Max User I/Os (family) 616 —
Embedded SRAM Up to 504 kbits true dual-port [DATA_NEEDED: Embedded SRAM capacity]
Process Technology 130-nm, 7-layer metal (6 copper), flash-based CMOS —
Core Supply Voltage 1.5 V [DATA_NEEDED: Core Supply Voltage]
Configuration Memory On-chip flash (live-at-power-up, single-chip) —
Speed Grade -1 (standard) -1
Temperatura de operação 0C to +70C (commercial) [DATA_NEEDED: Operating Temperature range]
Encapsulamento 484-ball FBGA (FGG484), 1.00 mm pitch 484-Ball FBGA (FGG484)
Tipo de montagem Surface Mount Surface Mount
Packaging Tray —
Frequência máxima de clock [DATA_NEEDED: maximum clock frequency] —
Status RoHS [DATA_NEEDED: RoHS status] —
User I/O — 280
Configuration Capacity — 276,480 bits
Temperature Grade — C (Commercial)
Technology — Nonvolatile Flash
Reprogrammable — Yes
Soft ARM Support — Optional
Instant On — Yes (no external boot flash)
RoHS — Compliant (G suffix)
Package Footprint Compatibility — FG256 and FG484 footprint-compatible
VREF Requirement — One voltage-referenced I/O per minibank for voltage-referenced standards

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