A3PE1500-1FGG48C vs A3PE1500-1FGG484 Vergleich
Detaillierter Direktvergleich von A3PE1500-1FGG48C von Microchip Technology und A3PE1500-1FGG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip
A3PE1500-1FGG48C ✓ AktivMicrochip Technology
A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip
A3PE1500-1FGG484 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE1500-1FGG48C | A3PE1500-1FGG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $43,10 | $48,10 |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 1,000,000 | 1,500,000 (1.5M) |
| User I/O | 280 | — |
| Configuration Capacity | 276,480 bits | — |
| Speed Grade | -1 | -1 (standard) |
| Temperature Grade | C (Commercial) | — |
| Technology | Nonvolatile Flash | — |
| Reprogrammable | Yes | — |
| Soft ARM Support | Optional | — |
| Gehäuse | 484-Ball FBGA (FGG484) | 484-ball FBGA (FGG484), 1.00 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Instant On | Yes (no external boot flash) | — |
| RoHS | Compliant (G suffix) | — |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| VREF Requirement | One voltage-referenced I/O per minibank for voltage-referenced standards | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature range] | 0C to +70C (commercial) |
| Core Supply Voltage | [DATA_NEEDED: Core Supply Voltage] | 1.5 V |
| Embedded SRAM | [DATA_NEEDED: Embedded SRAM capacity] | Up to 504 kbits true dual-port |
| Fabric Cells / Logic Capacity | — | 276,480 |
| Logic Cells | — | 38,400 |
| User I/Os (this package) | — | 280 |
| Max User I/Os (family) | — | 616 |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | — | On-chip flash (live-at-power-up, single-chip) |
| Packaging | — | Tray |
| Maximale Taktfrequenz | — | [DATA_NEEDED: maximum clock frequency] |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |