A3PE1500-1FGG48C vs A3PE1500-1FGG484 Comparação
Comparação detalhada lado a lado de A3PE1500-1FGG48C por Microchip Technology e A3PE1500-1FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip
A3PE1500-1FGG48C ✓ AtivoMicrochip Technology
A3PE1500-1FGG484 - ProASIC3E Flash FPGA 1.5M Gates | Microchip
A3PE1500-1FGG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE1500-1FGG48C | A3PE1500-1FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $43,10 | $48,10 |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 1,000,000 | 1,500,000 (1.5M) |
| User I/O | 280 | — |
| Configuration Capacity | 276,480 bits | — |
| Speed Grade | -1 | -1 (standard) |
| Temperature Grade | C (Commercial) | — |
| Technology | Nonvolatile Flash | — |
| Reprogrammable | Yes | — |
| Soft ARM Support | Optional | — |
| Encapsulamento | 484-Ball FBGA (FGG484) | 484-ball FBGA (FGG484), 1.00 mm pitch |
| Tipo de montagem | Surface Mount | Surface Mount |
| Instant On | Yes (no external boot flash) | — |
| RoHS | Compliant (G suffix) | — |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| VREF Requirement | One voltage-referenced I/O per minibank for voltage-referenced standards | — |
| Temperatura de operação | [DATA_NEEDED: Operating Temperature range] | 0C to +70C (commercial) |
| Core Supply Voltage | [DATA_NEEDED: Core Supply Voltage] | 1.5 V |
| Embedded SRAM | [DATA_NEEDED: Embedded SRAM capacity] | Up to 504 kbits true dual-port |
| Fabric Cells / Logic Capacity | — | 276,480 |
| Logic Cells | — | 38,400 |
| User I/Os (this package) | — | 280 |
| Max User I/Os (family) | — | 616 |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | — | On-chip flash (live-at-power-up, single-chip) |
| Packaging | — | Tray |
| Frequência máxima de clock | — | [DATA_NEEDED: maximum clock frequency] |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |