A3PE3000-1FGG484 vs A3PE3000L-1FGG484 Vergleich
Detaillierter Direktvergleich von A3PE3000-1FGG484 von Microchip Technology und A3PE3000L-1FGG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000-1FGG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG484 ✓ AktivMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000-1FGG484 | A3PE3000L-1FGG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.425,71 | $134,00 |
| Family | ProASIC3E | ProASIC3L |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75264 | 75,264 |
| User I/O | 341 | — |
| Embedded Memory Bits | 516096 | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | -1 | -1 |
| Gehäuse | 484-ball FBGA (FGG484) | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1 mm | — |
| Package Height | 2.23 mm | — |
| Montageart | Surface Mount | — |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | — |
| Temperature Grade | Commercial ([DATA_NEEDED: exact operating temperature range]) | — |
| RoHS-Status | Compliant (lead-free per Kynix listing) | [DATA_NEEDED: RoHS status] |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Embedded SRAM | — | Up to 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Montagestil | — | SMD/SMT |
| Betriebstemperatur | — | 0C to +70C |
| Packaging | — | Tray |
| Power-Up Mode | — | Live at power-up (Level 0 support) |