A3PE3000-1FGG484 vs A3PE3000L-1FGG484 Comparaison
Comparaison détaillée côte à côte de A3PE3000-1FGG484 par Microchip Technology et A3PE3000L-1FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-1FGG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG484 ✓ ActifMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-1FGG484 | A3PE3000L-1FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 425,71 | $134,00 |
| Family | ProASIC3E | ProASIC3L |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75264 | 75,264 |
| User I/O | 341 | — |
| Embedded Memory Bits | 516096 | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Speed Grade | -1 | -1 |
| Boîtier | 484-ball FBGA (FGG484) | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1 mm | — |
| Package Height | 2.23 mm | — |
| Type de montage | Surface Mount | — |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | — |
| Temperature Grade | Commercial ([DATA_NEEDED: exact operating temperature range]) | — |
| Statut RoHS | Compliant (lead-free per Kynix listing) | [DATA_NEEDED: RoHS status] |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Embedded SRAM | — | Up to 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Style de montage | — | SMD/SMT |
| Température de fonctionnement | — | 0C to +70C |
| Packaging | — | Tray |
| Power-Up Mode | — | Live at power-up (Level 0 support) |