A3PE3000-FG484 vs A3PE3000L-FG484 Vergleich

Detaillierter Direktvergleich von A3PE3000-FG484 von Microchip Technology und A3PE3000L-FG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000-FG484 A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

A3PE3000-FG484 ✓ Aktiv
Microchip Technology
A3PE3000L-FG484 A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000-FG484 A3PE3000L-FG484
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $139,75 $112,00
Family ProASIC3E Flash FPGA ProASIC3L (Low Power Flash FPGA)
System Gates 3000000 3000000
Logic Cells (DFEs) 75264 —
User I/O 341 —
Core Voltage 1.5 V —
System Frequency 231 MHz —
Process Technology 130 nm flash CMOS —
Configuration Memory On-chip flash (non-volatile, single-chip) —
Gehäuse 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height —
Montageart Surface Mount Surface Mount
Soft CPU Support Optional soft ARM support —
Differential I/O Standards LVDS, LVPECL —
Footprint Compatibility FG256 and FG484 footprint-compatible —
Packaging Tray —
RoHS-Status G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) [DATA_NEEDED: RoHS compliance]
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating Temperature]
Embedded Memory [DATA_NEEDED: embedded block RAM capacity] [DATA_NEEDED: Embedded RAM block capacity]
Logic Cells / CLBs — 75264
User I/Os — 341
Maximum System Frequency — 250 MHz
Core Voltage Range — 1.2 V to 1.5 V
Technology — 130 nm CMOS flash, nonvolatile
Configuration — Flash-based, Instant On, single-chip
Low Power Feature — Flash*Freeze technology
Package Type — 484-ball FBGA (PBGA484)
Package Dimensions — 23 x 23 mm, 1 mm ball pitch
Package Height — 2.23 mm
Process — CMOS
Supply Voltage I/O — [DATA_NEEDED: I/O supply voltage range]

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