A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
Teilenummer: A3PE3000-FG484 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $198.5 | $198,50 |
| 10 | $182.3 | $1.823,00 |
| 100 | $165.9 | $16.590,00 |
| 500 | $151.4 | $75.700,00 |
| 1.000 | $139.75 | $139.750,00 |
A3PE3000-FG484 Übersicht
A flash-based FPGA stores its configuration in on-chip flash memory rather than the SRAM cells used by Xilinx and Intel (Altera) FPGAs. This means the A3PE3000-FG484 is a single-chip, non-volatile, instant-on solution: no external configuration PROM, no boot time, and inherent resistance to configuration readback attacks. Within the power-management hierarchy of programmable logic, flash FPGAs occupy the secure, low-total-cost-of-ownership niche between ASICs and SRAM FPGAs.
Key features include reprogrammable flash fabric on a 130nm process, support for soft ARM processors via the CoreConsole/Libero design flow, single-chip operation that lowers bill-of-materials cost, and abundant advanced I/O standards including LVDS and LVPECL differential signaling. The FG484 package measures 23 x 23 mm with a 1.0 mm ball pitch and 2.23 mm height, and the FG256 and FG484 packages are footprint-compatible, providing an upgrade path within the family.
Architecturally, the ProASIC3E fabric combines versatile logic elements, embedded block RAM, and flash configuration cells, with optional ARM soft-core support for embedded control applications. The fabric's non-volatile nature also reduces system power during standby because no configuration load cycle is needed at power-up.
Typical applications include ASIC replacement in consumer electronics, networking and communications equipment, industrial computing, and avionics systems, where single-chip secure configuration and moderate gate density are valued.
When designing with this part, budget for bank-based VCCI voltages: multiple I/O banks allow mixed-voltage signaling, but voltage-referenced standards require one VREF pin per minibank.
This page synthesizes distributor pricing, drop-in alternatives across the ProASIC3/ProASIC3L families, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE3000-FG484 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000-FG484 (gleiche Bauform und Footprint) – abweichend in Package, Family, RoHS Status, Configuration, System Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000-FGG484
✅ Drop-In✓ Auf Lager
$152.6 / Stück
Datenblatt ansehen →A3PE3000-FGG484I
✅ Drop-In✓ Auf Lager
$1451.56 / Stück
Datenblatt ansehen →A3PE3000-2FGG484I
✅ Drop-In✓ Auf Lager
$89.4 / Stück
Datenblatt ansehen →A3PE3000L-FGG484M
✅ Drop-In✓ Auf Lager
$298 / Stück
Datenblatt ansehen →A3PE3000L-1FGG484M
✅ Drop-In✓ Auf Lager
$117.6 / Stück
Datenblatt ansehen →A3PE3000L-FGG484I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000-FG484 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E Flash FPGA |
| System Gates | 3000000 |
| Logic Cells (DFEs) | 75264 |
| User I/O | 341 |
| Core Voltage | 1.5 V |
| System Frequency | 231 MHz |
| Process Technology | 130 nm flash CMOS |
| Configuration Memory | On-chip flash (non-volatile, single-chip) |
| Gehäuse | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height |
| Montageart | Surface Mount |
| Soft CPU Support | Optional soft ARM support |
| Differential I/O Standards | LVDS, LVPECL |
| Footprint Compatibility | FG256 and FG484 footprint-compatible |
| Packaging | Tray |
| RoHS-Status | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) |
A3PE3000-FG484 484-ball fbga (fg484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height Pinbelegungsleitfaden
Pinbelegung für A3PE3000-FG484 (484-ball fbga (fg484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000-FG484.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000-FG484 ist geeignet für 6 Anwendungs: ASIC Replacement and Bridging, Networking and Communications Equipment, Avionics and Defense Electronics, Industrial Computing and Automation, Consumer Electronics ASIC Replacement, Secure Embedded Control with Soft ARM Cores.
ASIC Replacement and Bridging
The A3PE3000-FG484 is positioned by Microchip as a cost-effective ASIC replacement, and this is its primary use case. Its 3 million system gates (75,264 cells) absorb glue logic, bus bridging, and moderate datapath functions that would otherwise demand an ASIC with NRE costs and months of lead time. Because configuration lives in on-chip flash, one package replaces both the FPGA and its boot device, cutting BOM count and board area versus SRAM FPGAs. At 231 MHz system performance on a 130nm flash process, it comfortably handles 32-bit bus interfaces, memory controllers, and protocol conversion. Designers iterate HDL freely since the flash fabric is fully reprogrammable in-system, preserving late-stage specification changes that ASIC schedules cannot absorb.
Empfohlen
Networking and Communications Equipment
Line cards, switch fabrics, and telecom control planes benefit from the A3PE3000-FG484's combination of 341 user I/Os, LVDS and LVPECL differential signaling, and instant-on operation. In backplane interface applications, the differential I/O standards support low-noise point-to-point links, while the multiple VCCI I/O banks accommodate mixed 2.5V/1.8V/1.5V signaling domains common in communications shelves. The single-chip flash configuration means a line card powers up and becomes operational immediately, an availability advantage in redundant, hot-swap systems where SRAM FPGA configuration time adds to failover delay. With 3 million gates, the device implements framing, deserialization, and housekeeping logic around dedicated PHY devices.
Empfohlen
Avionics and Defense Electronics
The ProASIC3E family is explicitly targeted at avionics markets in the Microchip datasheet, and the A3PE3000-FG484 fits ruggedized modules needing secure, deterministic power-up. The on-chip flash configuration contains the design internally with no external configuration readback path, supporting anti-tamper and supply-chain assurance goals. Industrial temperature variants (A3PE3000-FGG484I) extend operation beyond commercial ranges for flight-deck and mission-computer environments. The instant-on fabric means the FPGA is functional before a host processor completes boot, allowing it to perform power sequencing, monitor inputs, or gate signals during system bring-up - a common architectural role in avionics boxes where failure-mode timing is scrutinized.
Empfohlen
Industrial Computing and Automation
Industrial PCs, PLC backplanes, and motion-control racks use the A3PE3000-FG484 for deterministic I/O expansion and legacy interface emulation. The 341 user I/Os allow dense parallel fieldbus connections, and the flash fabric reconfigures in-system so a single PCB serves multiple product SKUs with different firmware - a powerful cost lever in low-volume, high-variety industrial products. Its 1.5V core with banked VCCI matches the mixed 3.3V/2.5V/1.8V rails of legacy industrial boards, enabling direct interface to 5V-tolerant-adjacent logic families through appropriate level-shifting banks. The 231 MHz system performance covers encoder interpolation and PWM generation tasks with margin for supervisory logic in the same device.
Empfohlen
Consumer Electronics ASIC Replacement
In consumer platforms such as set-top boxes, display controllers, and gaming peripherals, the A3PE3000-FG484 bridges silicon revisions and postpones ASIC commitment until volumes justify mask costs. Microchip's datasheet names the consumer market directly as a ProASIC3E target, citing low total cost of ownership: no NRE, no boot PROM, and reprogrammability for late feature additions. The 23 x 23 mm 484-FBGA fits standard SMT assembly, and the footprint compatibility between FG256 and FG484 lets one PCB layout scale across density points. At 1.5V core with bank-selectable VCCI, the device integrates into typical consumer power trees without dedicated FPGA regulators, simplifying the power design.
Empfohlen
Secure Embedded Control with Soft ARM Cores
The A3PE3000-FG484 supports optional soft ARM processors, enabling single-chip embedded controllers where firmware and hardware logic must coexist securely. With 75,264 cells of fabric, designers instantiate an ARM soft core plus custom peripherals (UART, SPI, custom accelerators) and keep the entire design in non-volatile flash - no external boot device whose contents could be cloned. The 130nm flash process and single-chip configuration support design-security requirements in licensing, metering, and encrypted-communications nodes. Instant-on behavior also means the soft processor begins executing immediately at power-up, which suits control applications that must act within milliseconds of rail stabilization rather than waiting for a host to load configuration.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000-FG484 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000-FGG484 | A3PE3000-FGG484I | A3PE3000-2FGG484I | A3PE3000L-FGG484M |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-FBGA (23 x 23 mm, 1.0 mm pitch) | 484-FBGA - same footprint | 484-FBGA - same footprint | 484-FBGA - same footprint | 484-FBGA - same footprint |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 341 | 341 | 341 | 341 | 341 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V / 1.5 V (low-power core option) |
| Speed Grade | Standard | Standard | Standard | -2 (faster) | Standard (L low-power) |
| RoHS Green Package | No (standard FG484) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) |
| Power Profile | Standard ProASIC3E | Standard | Standard | Standard | Low power (ProASIC3L) |
Wichtigste Unterscheidungsmerkmale
- Single-chip non-volatile flash configuration (vs. XC6SLX9 (Xilinx Spartan-6))
- Industrial temperature and RoHS upgrade path without PCB rework (vs. A3PE3000-FGG484I)
- Low-power sibling on the same footprint (vs. A3PE3000L-FGG484M)
- Faster timing without footprint change (vs. A3PE3000-2FGG484I)
Designhinweise
Power the 1.5V core with a dedicated low-noise regulator and respect I/O bank VCCI sequencing requirements from the ProASIC3E datasheet. Because the fabric is flash-based there is no inrush associated with configuration loading, but I/O bank VCCI rails should ramp in an order that avoids back-powering through clamp diodes if banks share external loads. Estimated: a 75,264-cell fabric with moderate utilization at 231 MHz toggling roughly 20% of nodes can draw several hundred milliamps on VCCI - size the bank regulators accordingly and confirm with Libero power analysis for your actual design.
The 484-FBGA has a 1.0 mm ball pitch on a 23 x 23 mm body; fan out using via-in-pad or dog-bone escapes on 0.3 mm drill vias capped as needed. Dedicate one solid ground plane directly beneath the package for return current paths of the LVDS/LVPECL differential pairs. Per the datasheet, FG256 and FG484 are footprint-compatible, so if board reuse across densities is planned, design the escape pattern to accommodate the FG484 ball map from the start. Place 0.1 uF decoupling capacitors within 3 mm of VCCI/VCCA ball pairs, one pair per I/O bank.
Do not assume this non-G part satisfies RoHS procurement mandates - per the datasheet ordering information, only packages with the G suffix (e.g., A3PE3000-FGG484) are RoHS-compliant green packages. Second, voltage-referenced I/O standards require one VREF pin assigned per minibank; forgetting VREF assignment in Libero causes implementation errors late in the design cycle. Third, this is a legacy 130nm family: verify Libero license coverage for A3PE devices before committing the design flow, and avoid mixing speed grades in multi-sourced builds since -2 timing may not close at standard-grade timing constraints.
LVDS transmitters in ProASIC3E require external resistor termination per the datasheet's differential I/O implementation section; route LVDS pairs with matched length (skew under 5 mm) and 100-ohm differential impedance referencing the adjacent ground plane. Keep VREF minibank traces short and quiet when using voltage-referenced standards such as SSTL/HSTL, as VREF bounce directly reduces noise margin. For the 341 user I/Os, distribute high-toggle-rate signals across banks to spread simultaneous switching noise and reduce ground bounce on the 1.0 mm-pitch ball array.
Compliance-Informationen
Per the ProASIC3E datasheet, packages with the G suffix (e.g., A3PE3000-FGG484) are RoHS-compliant; this base A3PE3000-FG484 ordering code lacks the G suffix. Xecor comparison data shows Rohs Code Yes for FGG484 variants and No for the non-G variant. Full REACH/lead-free/halogen details for this specific ordering code: unknown - verify on the Microchip product page.
