A3PE3000L-1FG324ID vs A3PE3000L-FGG324 Vergleich
Detaillierter Direktvergleich von A3PE3000L-1FG324ID von Microchip Technology und A3PE3000L-FGG324 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-1FG324ID - Low Power Flash FPGA 324-BGA | Microchip
A3PE3000L-1FG324ID ✓ AktivMicrochip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-1FG324ID | A3PE3000L-FGG324 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $142,60 | $86,15 |
| Family | ProASIC3L Low Power Flash FPGA | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 gates | 3,000,000 |
| Logic Cells (CLBs) | 75264 | 75264 |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V to 1.5 V | — |
| Process Technology | 130 nm CMOS flash | — |
| Gehäuse | 324-BGA (FG324) | 324-BGA / FBGA (FGG324) |
| Montageart | Surface Mount | — |
| Technology | Flash-based (single-chip, reprogrammable) | — |
| Low Power Feature | Flash*Freeze Technology | — |
| Dynamic Power Reduction | 40% vs equivalent ProASIC3 | — |
| Static Power Reduction | 50% vs equivalent ProASIC3 | — |
| JTAG Boundary Scan | IEEE 1149.1 | — |
| Schmitt Trigger Input Option | Yes (single-ended inputs) | — |
| Weak Pull-Up/Pull-Down | Yes | — |
| Betriebstemperatur | Industrial (I grade) | 0 C to +70 C (commercial) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Maximum Operating Frequency | [DATA_NEEDED: Fmax] | 250 MHz |
| Manufacturer Part Number | — | A3PE3000L-FGG324 |
| Configuration Memory | — | On-chip Flash (single-chip, nonvolatile) |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Betriebsversorgungsspannung | — | 1.5 V |
| Special Features | — | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |
| Montagestil | — | SMD/SMT |
| Packaging | — | Tray |
| Embedded RAM | — | [DATA_NEEDED: embedded RAM capacity] |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |