A3PE3000L-1FG484M vs A3PE3000L-FG484 Vergleich
Detaillierter Direktvergleich von A3PE3000L-1FG484M von Microchip Technology und A3PE3000L-FG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG484M ✓ AktivMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-1FG484M | A3PE3000L-FG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $112,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3000000 |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Number of I/O | 341 | — |
| Maximum Frequency | 250 MHz | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Technology | 130 nm flash process | 130 nm CMOS flash, nonvolatile |
| Configuration Memory | On-chip Flash (instant-on, reprogrammable) | — |
| Low Power Feature | Flash*Freeze technology | Flash*Freeze technology |
| Gehäuse | 484-ball FBGA (FG484) | — |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | -1 (standard) | — |
| Temperature Grade / Operating Temp | M (per ordering code); [DATA_NEEDED: exact operating temperature range] | — |
| JTAG Boundary Scan | IEEE 1149.1 supported | — |
| Input Options | Schmitt trigger option on single-ended inputs (A3PE3000L) | — |
| Pull Options | Weak pull-up / pull-down | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Configuration | — | Flash-based, Instant On, single-chip |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Betriebstemperatur | — | [DATA_NEEDED: Operating Temperature] |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |