A3PE3000L-1FGG484I vs A3PE3000L-1FGG484 Vergleich
Detaillierter Direktvergleich von A3PE3000L-1FGG484I von Microchip Technology und A3PE3000L-1FGG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ AktivMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-1FGG484I | A3PE3000L-1FGG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $104,50 | $134,00 |
| Family | ProASIC3L | ProASIC3L |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Versorgungsspannung | 1.14 V to 1.575 V | — |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | -1 |
| Gehäuse / Bauform | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | -40C to +100C (TJ) | 0C to +70C |
| Technology | 130 nm Flash | — |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | Tray |
| RoHS-Status | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| System Gates | — | 3,000,000 |
| Logic Cells | — | 75,264 |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Embedded SRAM | — | Up to 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Gehäuse | — | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Montagestil | — | SMD/SMT |
| Power-Up Mode | — | Live at power-up (Level 0 support) |