A3PE3000L-1FGG484I vs A3PE3000L-1FGG484 Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FGG484I par Microchip Technology et A3PE3000L-1FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ ActifMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FGG484I | A3PE3000L-1FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $104,50 | $134,00 |
| Family | ProASIC3L | ProASIC3L |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Tension d'alimentation | 1.14 V to 1.575 V | — |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | -1 |
| Boîtier / Format | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Type de montage | Surface Mount | — |
| Température de fonctionnement | -40C to +100C (TJ) | 0C to +70C |
| Technology | 130 nm Flash | — |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | Tray |
| Statut RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| System Gates | — | 3,000,000 |
| Logic Cells | — | 75,264 |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Embedded SRAM | — | Up to 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Boîtier | — | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Style de montage | — | SMD/SMT |
| Power-Up Mode | — | Live at power-up (Level 0 support) |