A3PE3000L-FG484M vs A3PE3000L-FGG484 Vergleich

Detaillierter Direktvergleich von A3PE3000L-FG484M von Microchip Technology und A3PE3000L-FGG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-FG484M A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FG484M ✓ Aktiv
Microchip Technology
A3PE3000L-FGG484 A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-FG484M A3PE3000L-FGG484
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $129,00 $0,00
Family ProASIC3L (Flash-based FPGA) ProASIC3L (Low Power Flash FPGA)
System Gates 3000000 (3.00E6) 3,000,000
Logic Elements (VersaTiles) 75264 —
True Dual-Port SRAM 504 kbits —
User I/O 341 (up to 616 in larger packages) 341
Core Voltage 1.2 V to 1.5 V 1.2 V to 1.5 V
Process Technology 130-nm, 7-layer metal (6 copper) flash-based CMOS 130 nm flash
Logic Family CMOS —
Configuration Memory Nonvolatile on-chip flash, live at power-up (Level 0) —
Low-Power Feature Flash*Freeze technology —
Betriebstemperatur 0 to 70 C [DATA_NEEDED: operating temperature range]
Versorgungsspannung 1.5 V —
Package Type FBGA-484, 1 mm pitch, 23 x 23 mm —
Pins / Balls 484 —
Montageart Surface Mount Surface Mount
Single-Chip Solution Yes (no external configuration device required) —
Logic Cells — 75,264
Embedded RAM — 516,096 bits
Configuration Technology — Nonvolatile flash, Instant On
Low Power Feature — Flash*Freeze technology
Gehäuse — 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch
Supply Voltage - I/O — [DATA_NEEDED: I/O bank voltage range]
RoHS-Status — Compliant (per Newark: RoHS Compliant: Yes)
Packaging — Tray
Security — Single-chip, flash-based, secure nonvolatile configuration

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern