A3PE3000L-FG484M vs A3PE3000L-FGG484 对比

详细并排对比 A3PE3000L-FG484M 出自 Microchip Technology 和 A3PE3000L-FGG484 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000L-FG484M A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FG484M ✓ 量产中
Microchip Technology
A3PE3000L-FGG484 A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 ✓ 量产中

规格对比

参数 A3PE3000L-FG484M A3PE3000L-FGG484
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $129.00 $0.00
Family ProASIC3L (Flash-based FPGA) ProASIC3L (Low Power Flash FPGA)
System Gates 3000000 (3.00E6) 3,000,000
Logic Elements (VersaTiles) 75264 —
True Dual-Port SRAM 504 kbits —
User I/O 341 (up to 616 in larger packages) 341
Core Voltage 1.2 V to 1.5 V 1.2 V to 1.5 V
Process Technology 130-nm, 7-layer metal (6 copper) flash-based CMOS 130 nm flash
Logic Family CMOS —
Configuration Memory Nonvolatile on-chip flash, live at power-up (Level 0) —
Low-Power Feature Flash*Freeze technology —
工作温度 0 to 70 C [DATA_NEEDED: operating temperature range]
电源电压 1.5 V —
Package Type FBGA-484, 1 mm pitch, 23 x 23 mm —
Pins / Balls 484 —
安装类型 Surface Mount Surface Mount
Single-Chip Solution Yes (no external configuration device required) —
Logic Cells — 75,264
Embedded RAM — 516,096 bits
Configuration Technology — Nonvolatile flash, Instant On
Low Power Feature — Flash*Freeze technology
封装 — 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch
Supply Voltage - I/O — [DATA_NEEDED: I/O bank voltage range]
RoHS 状态 — Compliant (per Newark: RoHS Compliant: Yes)
Packaging — Tray
Security — Single-chip, flash-based, secure nonvolatile configuration

数据手册与资源

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