A3PE3000L-FG896I vs A3PE3000L-FGG896M Vergleich

Detaillierter Direktvergleich von A3PE3000L-FG896I von Microchip Technology und A3PE3000L-FGG896M von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-FG896I A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip

A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip

A3PE3000L-FG896I ✓ Aktiv
Microchip Technology
A3PE3000L-FGG896M A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip

A3PE3000L-FGG896M ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-FG896I A3PE3000L-FGG896M
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $0,00
Family ProASIC3L (Low Power Flash FPGA) ProASIC3L (Flash-based FPGA)
System Gates 3000000 3,000,000
Logic Cells 75264 75,264
User I/O 620 —
Core Voltage 1.2 V to 1.5 V 1.2 V to 1.5 V
I/O Voltage (minimum) 1.2 V —
Configuration Memory On-chip Flash (single-chip, nonvolatile) —
Low Power Feature Flash*Freeze technology (40% dynamic / 50% static power reduction) —
Gehäuse 896-BGA (FBGA-896) 896-ball FBGA (FGG896), 1 mm pitch
Montageart Surface Mount Surface Mount
Temperature Grade Industrial (-I suffix) —
Reprogrammability Yes (in-system reprogrammable) —
RoHS-Status RoHS Non-Compliant (per distributor listing) —
Lead Free Status Contains Lead (per distributor listing) —
Speed Grade [DATA_NEEDED: speed grade / grade code] —
Betriebstemperaturbereich [DATA_NEEDED: exact operating temperature range in C] —
Embedded Memory [DATA_NEEDED: embedded SRAM block capacity] —
User I/Os — Up to 616 (620 per DigiKey listing)
Embedded SRAM — 504 kbits true dual-port
Process Technology — 130-nm, 7-layer metal (6 copper), flash-based CMOS
Versorgungsspannung — 1.5 V
Logic Family — CMOS
Betriebstemperatur — 0 to 70 C
Configuration — Non-volatile flash, live-at-power-up Level 0, single-chip
Low-Power Feature — Flash*Freeze technology
Boundary Scan — IEEE 1149.1 (JTAG)
Input Features — Schmitt trigger option on single-ended inputs; weak pull-up/pull-down

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