A3PE3000L-FGG324 vs A3PE3000-FGG324I Vergleich
Detaillierter Direktvergleich von A3PE3000L-FGG324 von Microchip Technology und A3PE3000-FGG324I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ AktivMicrochip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-FGG324 | A3PE3000-FGG324I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $86,15 | $198,00 |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3,000,000 | 3000000 gates |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | — |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | Nonvolatile flash, reprogrammable, Instant-On |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Betriebsversorgungsspannung | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Gehäuse | 324-BGA / FBGA (FGG324) | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Montagestil | SMD/SMT | — |
| Betriebstemperatur | 0 C to +70 C (commercial) | -40 C to +125 C (Industrial, I grade) |
| Packaging | Tray | — |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements (CLBs) | — | 75264 |
| Total User I/O | — | 221 |
| Embedded Memory | — | 516096 bits |
| Maximum Frequency | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm CMOS, nonvolatile flash |
| Ball Pitch | — | 1 mm |
| Package Height | — | 1.63 mm |
| Montageart | — | Surface Mount |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |