A3PE3000L-FGG896 vs A3PE3000L-FGG896I Vergleich

Detaillierter Direktvergleich von A3PE3000L-FGG896 von Microchip Technology und A3PE3000L-FGG896I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-FGG896 A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

A3PE3000L-FGG896 ✓ Aktiv
Microchip Technology
A3PE3000L-FGG896I A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-FGG896I ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-FGG896 A3PE3000L-FGG896I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $55,00 $139,90
System Gates 3,000,000 3000000
Logic Cells 75,264 —
Total SRAM 504 kbits —
User I/Os (FGG896) 620 —
Gehäuse 896-ball FBGA (FGG896), 1.0 mm pitch —
Montageart Surface Mount Surface Mount (SMD/SMT)
Core Supply Voltage 1.2 V to 1.5 V —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage range] —
Betriebstemperatur 0 C to +70 C Industrial grade (I suffix)
Logic Family CMOS —
Process Technology 130-nm, 7-layer metal (6 copper), flash-based —
Flash*Freeze Support Yes —
Live-At-Power-Up Level 0 support —
Reconfiguration Reprogrammable (in-system programmable) —
Lead-Free Finish Yes —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Clock Inputs [DATA_NEEDED: number of clock conditioning circuits/PLLs] —
Speed Grade [DATA_NEEDED: speed grade for -FGG896 base part] Standard (no speed suffix)
Power Consumption [DATA_NEEDED: typical static/dynamic power] —
Ball Count 896 —
Family — ProASIC3L
Total RAM Bits — 516096 bits
Embedded Memory Type — True Dual-Port SRAM (504 kbits)
Number of I/O — 620
Versorgungsspannung — 1.14 V to 1.575 V
Core Voltage Support — 1.2 V to 1.5 V
Logic Family / Process — CMOS, 130-nm, 7-layer metal (6 copper), flash-based
Configuration Technology — Nonvolatile Flash, Live-at-Power-Up Level 0
Special Features — Flash*Freeze technology, single-chip solution
Gehäuse / Bauform — 896-BGA (FBGA, 1 mm pitch)
Packaging — Tray, standard quantity 27

Datenblätter & Ressourcen

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