A3PE3000L-FGG896 vs A3PE3000L-FGG896I 비교
다음의 상세 나란히 비교: A3PE3000L-FGG896 제조: Microchip Technology 및 A3PE3000L-FGG896I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
A3PE3000L-FGG896 ✓ 활성Microchip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ 활성사양 비교
| 파라미터 | A3PE3000L-FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $55.00 | $139.90 |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | — |
| Total SRAM | 504 kbits | — |
| User I/Os (FGG896) | 620 | — |
| 패키지 | 896-ball FBGA (FGG896), 1.0 mm pitch | — |
| 실장 유형 | Surface Mount | Surface Mount (SMD/SMT) |
| Core Supply Voltage | 1.2 V to 1.5 V | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage range] | — |
| 동작 온도 | 0 C to +70 C | Industrial grade (I suffix) |
| Logic Family | CMOS | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based | — |
| Flash*Freeze Support | Yes | — |
| Live-At-Power-Up | Level 0 support | — |
| Reconfiguration | Reprogrammable (in-system programmable) | — |
| Lead-Free Finish | Yes | — |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Clock Inputs | [DATA_NEEDED: number of clock conditioning circuits/PLLs] | — |
| Speed Grade | [DATA_NEEDED: speed grade for -FGG896 base part] | Standard (no speed suffix) |
| Power Consumption | [DATA_NEEDED: typical static/dynamic power] | — |
| Ball Count | 896 | — |
| Family | — | ProASIC3L |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| 공급 전압 | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| 패키지 / 케이스 | — | 896-BGA (FBGA, 1 mm pitch) |
| Packaging | — | Tray, standard quantity 27 |