A3PE600-1FGG484I vs A3PE600-FGG484I Vergleich
Detaillierter Direktvergleich von A3PE600-1FGG484I von Microchip Technology und A3PE600-FGG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE600-1FGG484I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-1FGG484I ✓ AktivMicrochip Technology
A3PE600-FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FGG484I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE600-1FGG484I | A3PE600-FGG484I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $42,40 | $44,03 |
| Family | ProASIC3E | ProASIC3E |
| System Gates | 600000 gates | 600000 |
| Logic Elements | ProASIC3, 7KLEs class fabric | — |
| Maximum System Frequency | 272 MHz (speed grade -1) | — |
| User I/O | 270 | — |
| Embedded SRAM | 110592 bits | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS | — |
| Configuration Memory | On-chip flash (nonvolatile, live at power-up) | On-chip flash (Instant On, single chip) |
| Gehäuse | 484-ball FBGA (FGG484), 1 mm pitch | FBGA-484 (PBGA484), green |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | Industrial (I suffix); die-level commercial rating 0C to 70C per digichip listing | -40C to +85C (Industrial) |
| Logic Family | CMOS | — |
| Soft Processor Support | Optional soft ARM support (per family datasheet) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (green package per Jotrin) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Cells | — | 13824 cells |
| CLBs | — | 13824 |
| Maximum Frequency | — | 350 MHz |
| User I/Os | — | 270 |
| Embedded Flash Memory | — | 110592 bits |
| Technology | — | CMOS, flash-based nonvolatile |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1.0 mm ball pitch |
| Terminal Form | — | Ball |
| Number of Terminals | — | 484 |