A3PE600-1FGG484I - ProASIC3E 600K-Gate Flash FPGA | Microchip
Teilenummer: A3PE600-1FGG484I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $49.07 | $49,07 |
| 10 | $47.5 | $475,00 |
| 100 | $45.8 | $4.580,00 |
| 500 | $44.1 | $22.050,00 |
| 1.000 | $42.4 | $42.400,00 |
A3PE600-1FGG484I Übersicht
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external SRAM configuration device. Within the programmable logic hierarchy, the FPGA sits above CPLDs and below ASSPs/ASICs in integration, and the ProASIC3E family occupies the nonvolatile, single-chip segment of that hierarchy, meaning the device is live-at-power-up (Level 0 support) with no external boot PROM required.
Key differentiating features include true single-chip operation, reprogrammability without a configuration flash, optional soft ARM support per the family datasheet, up to 504 kbits of true dual-port SRAM across the family, and low total cost of ownership due to the elimination of the configuration device. The ProASIC3E fabric delivers system performance in the 231-272 MHz class depending on speed grade.
Technically, the A3PE600 is built from VersaTiles, Microchip's fine-grain flash-based logic element, with embedded memory blocks distributed across the fabric. The 1.5V core and 130-nm process yield a balance of static power and logic density suited to glue logic consolidation, bus bridging, and control-plane functions.
Typical applications include industrial automation control, communications line-card bridging, medical instrumentation control logic, and aerospace/defense systems that benefit from nonvolatile, single-chip, secure configuration.
Design consideration: the 484-FBGA requires attention to power-plane segmentation for 1.5V core versus I/O banks, and BGA rework constraints make speed-grade and temperature-grade selection important before layout.
This page synthesizes distributor pricing, verified drop-in alternatives within the ProASIC3E family, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE600-1FGG484I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE600-1FGG484I (gleiche Bauform und Footprint) – abweichend in Package, Configuration Memory, Operating Temperature, RoHS Status, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE600-FG484I
✅ Drop-In✓ Auf Lager
$86.1 / Stück
Datenblatt ansehen →A3PE600-2FGG484I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE600-FGG484I
✅ Drop-In✓ Auf Lager
$44.03 / Stück
Datenblatt ansehen →A3PE600-2FG484I
✅ Drop-In✓ Auf Lager
$79.9 / Stück
Datenblatt ansehen →A3PE600-1FGG484
✅ Drop-In✓ Auf Lager
$44.9 / Stück
Datenblatt ansehen →A3PE600-FGG484
✅ Drop-In✓ Auf Lager
$53.7 / Stück
Datenblatt ansehen →A3PE600-1FGG484I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E |
| System Gates | 600000 gates |
| Logic Elements | ProASIC3, 7KLEs class fabric |
| Maximum System Frequency | 272 MHz (speed grade -1) |
| User I/O | 270 |
| Embedded SRAM | 110592 bits |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration Memory | On-chip flash (nonvolatile, live at power-up) |
| Gehäuse | 484-ball FBGA (FGG484), 1 mm pitch |
| Montageart | Surface Mount |
| Betriebstemperatur | Industrial (I suffix); die-level commercial rating 0C to 70C per digichip listing |
| Logic Family | CMOS |
| Soft Processor Support | Optional soft ARM support (per family datasheet) |
A3PE600-1FGG484I 484-ball fbga (fgg484), 1 mm pitch Pinbelegungsleitfaden
Pinbelegung für A3PE600-1FGG484I (484-ball fbga (fgg484), 1 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE600-1FGG484I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE600-1FGG484I ist geeignet für 6 Anwendungs: Industrial Automation Control, Communications Line-Card Bridging, Medical Instrumentation Control, Aerospace and Defense Ground Systems, Test and Measurement Equipment, Secure Embedded Systems / IoT Gateways.
Industrial Automation Control
The A3PE600-1FGG484I fits industrial automation because its 600K-gate flash fabric and 270 user I/Os consolidate PLC I/O modules, motor control sequencing, and fieldbus interface logic into one 1.5V-core, 484-FBGA device. Its nonvolatile live-at-power-up configuration eliminates the external configuration PROM required by SRAM FPGAs, improving startup determinism on factory lines that must resume within milliseconds of power restoration. The 272 MHz (-1 grade) performance class comfortably handles state machines and protocol bridging below 100 MHz. Because the I-suffix part is rated for the industrial temperature variant, it can sit inside sealed control cabinets near drives where ambient temperatures rise. Trade-off: fabric routing consumes more power than a CPLD at equivalent logic, so verify power with Microchip's estimator at your utilization level.
Empfohlen
Communications Line-Card Bridging
In telecom and datacom line cards, the A3PE600-1FGG484I serves as a glue-logic and bus-bridging device between PHYs, framers, and backplane interfaces. The 270 user I/Os and 110592 bits of embedded dual-port SRAM support FIFO buffering between asynchronous clock domains, while the 130-nm fabric's 272 MHz class timing accommodates common line-card clock trees. The flash-based, live-at-power-up architecture lets the board enumerate and pass traffic without waiting for configuration from a host, an advantage over SRAM FPGAs in redundant systems. The 484-FBGA footprint provides enough balls for wide parallel backplane buses with ground-signal interleaving. Designers should bank-plan I/O standards early, since ProASIC3E I/O banks constrain mixed-voltage groupings on the 484-ball package.
Empfohlen
Medical Instrumentation Control
Medical diagnostic and monitoring equipment benefits from the A3PE600-1FGG484I's single-chip, nonvolatile design: there is no bitstream to intercept in the field, which supports design-protection requirements common in medical OEMs, and live-at-power-up behavior means patient-facing systems are ready immediately after power-on self-test. The 600K gates absorb sensor-interface sequencing, front-end multiplexing, and display control, while the 270 user I/Os handle the many discrete signals typical of lab instruments. The industrial I-suffix temperature range supports benchtop equipment with elevated internal temperatures near power supplies. Implementation is in Microchip Libero with optional soft ARM support for embedded control routines. Note that FDA-regulated designs should document the FPGA configuration checksum as part of design controls.
Empfohlen
Aerospace and Defense Ground Systems
The ProASIC3E family is widely deployed in defense ground equipment because flash-based configuration resists single-event configuration upset better than SRAM fabrics and requires no configuration readback on power-up, reducing boot vulnerabilities. The A3PE600-1FGG484I's 600K gates handle radar interface conditioning, secure-communications glue logic, and test-set control, with 270 user I/Os supporting legacy parallel military bus interfaces. The 484-FBGA's 1 mm pitch aids inspection for conformal-coated assemblies. For flight programs, Microchip offers radiation-tolerant RT3PE600L variants; the commercial A3PE600-1FGG484I targets ground-based, avionics-test, and lab systems. Use Microchip's Libero security features to lock the flash bitstream, and derate timing for extended-temperature chassis environments.
Empfohlen
Test and Measurement Equipment
Bench instruments and rack-mounted testers use the A3PE600-1FGG484I as channel-control logic: multiplexing test signals, generating trigger sequences, and interfacing between a host processor and per-channel analog front ends. The 272 MHz-class fabric and 110592-bit embedded SRAM support timestamping and capture-buffer functions, while 270 I/Os accommodate high-channel-count switch matrices typical of ATE. Flash configuration means the instrument powers to a known functional state without a boot loader, shortening instrument startup, which matters in automated production test where throughput is measured per second. Design the 484-FBGA power delivery with dedicated 1.5V core planes and measure I/O bank loading, since simultaneous-switching outputs on wide buses drive ground-bounce considerations in BGA fanout regions.
Empfohlen
Secure Embedded Systems / IoT Gateways
Embedded gateways and secure controllers leverage the A3PE600-1FGG484I's inherent configuration security: the bitstream lives in on-chip flash with lockable security settings in Libero, and no external configuration device exposes the design on the bus - a structural advantage over SRAM FPGAs. The 600K gates implement custom peripherals, crypto accelerators at modest throughputs, and secure-boot state machines around a host MCU, while 270 user I/Os connect legacy field buses alongside modern interfaces. Live-at-power-up Level 0 support lets the FPGA enforce access policy before the host processor boots. The 1.5V core and 130-nm process keep static power acceptable for always-on edge equipment; estimate dynamic power in Libero's Power Calculator at your clock utilization to validate thermal budgets in sealed enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE600-1FGG484I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE600-FG484I | A3PE600-2FGG484I | A3PE600-FGG484I |
|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| Package | 484-FBGA (FGG484), 1 mm pitch | 484-FBGA (FG484) - same footprint per FindIC | 484-FBGA (FGG484) - identical | 484-FBGA (FGG484) - identical |
| System Gates | 600000 | 600000 | 600000 | 600000 |
| Speed Grade / Max Performance | -1, 272 MHz class | 231 MHz class (FindIC) | -2 (faster than -1) | base grade (slower class) |
| User I/O | 270 | 270 | 270 | 270 |
| Embedded SRAM | 110592 bits | 110592 bits | 110592 bits | 110592 bits |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) |
| Configuration | On-chip flash, live at power-up | On-chip flash, live at power-up | On-chip flash, live at power-up | On-chip flash, live at power-up |
Wichtigste Unterscheidungsmerkmale
- Faster -1 speed grade than FG484I cross-reference part (vs. A3PE600-FG484I)
- Lower cost than the faster -2 grade (vs. A3PE600-2FGG484I)
- Industrial temperature rating (vs. A3PE600-1FGG484)
- Single-chip nonvolatile configuration (vs. SRAM-based FPGAs (e.g., Xilinx Spartan class))
Designhinweise
The A3PE600-1FGG484I requires a dedicated 1.5V core rail separate from I/O bank supplies. Segment the 484-FBGA power delivery by I/O bank voltage before fanout, since ProASIC3E I/O banks constrain which standards may share a bank. Use Microchip Libero's Power Calculator to estimate core and I/O current at your utilization and clock frequencies, then size the core regulator with margin; never share the core rail with noisy I/O rails. Decouple each supply ball with a combination of bulk and 0.1 uF ceramics placed as close to the via fanout as the BGA escape allows.
A 484-ball 1 mm-pitch FBGA needs careful escape routing: plan via-in-pad or dog-bone fanout, and reserve inner layers for a solid 1.5V plane and contiguous ground return. Because the FGG484 footprint is shared across the entire A3PE600 family (FG484, FGG484, and -2 speed grades per FindIC cross-references), design the PCB so a future speed-grade or package-suffix swap requires no layout change. Follow the Microchip ProASIC3E datasheet's package mechanical drawing for ball A1 orientation and keep JTAG programming balls accessible to a FlashPro header.
Select the speed grade before layout sign-off: the -1 grade tops out in the 272 MHz class, and designs that marginalize timing will need the -2 (A3PE600-2FGG484I), which is drop-in but higher cost. Also confirm temperature grade - the I suffix is the industrial variant, while non-I siblings such as A3PE600-1FGG484 carry a commercial 0-70C die rating per digichip listings; substituting a commercial part into an industrial socket is a silent reliability failure. Finally, re-run static timing analysis in Libero whenever swapping any same-footprint variant, since timing corners differ per grade.
Compliance-Informationen
Compliance statuses were not stated in the provided verified web data; consult the Microchip product page certificate of conformance. AEC-Q100 is not applicable to this commercial/industrial FPGA family.
