A3PE600-FGG256I vs A3PE600-1FGG256I Vergleich
Detaillierter Direktvergleich von A3PE600-FGG256I von Microchip Technology und A3PE600-1FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ AktivMicrochip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE600-FGG256I | A3PE600-1FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $41,80 | $33,50 |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 600000 gates | 600000 |
| Logic Elements (VersaTiles) | 13824 | — |
| User I/O | 165 | 165 |
| Embedded Flash Memory | 110592 bits | — |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V (1.5 V nominal) |
| Maximum Internal Performance | 350 MHz | — |
| Gehäuse | 256-FBGA (S-PBGA-B256), 17 x 17 mm | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Ball Pitch | 1.0 mm | — |
| Package Height | 1.6 mm | — |
| Betriebstemperatur | -40C to +85C (Industrial) | -40C to +100C (TJ), industrial |
| Montageart | Surface Mount | Surface Mount |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) | On-chip Flash (Live at Power-Up, Level 0) |
| RoHS-Status | Compliant (lead free) | [DATA_NEEDED: RoHS compliance status] |
| Process Technology | CMOS flash FPGA | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Footprint Compatibility | FG256 and FG484 footprint-compatible packages | — |
| Logic Cells | — | 13824 |
| Embedded SRAM | — | 110592 bits (up to 504 kbits family density) |
| Maximum System Performance | — | 272 MHz |
| Logic Family | — | CMOS |
| Speed Grade | — | -1 |
| Reprogrammability | — | Yes (single-chip, no external boot PROM) |
| Typical Application Domains | — | Industrial, communications, medical, aerospace/defense |