A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
Teilenummer: A3PE600-FGG256I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $62.5 | $62,50 |
| 10 | $56.9 | $569,00 |
| 100 | $51.2 | $5.120,00 |
| 500 | $46.1 | $23.050,00 |
| 1.000 | $41.8 | $41.800,00 |
A3PE600-FGG256I Übersicht
A Flash FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. In the programmable-logic hierarchy, it sits alongside SRAM FPGAs and CPLDs as a class of programmable logic ICs, but unlike SRAM-based devices it is a true single-chip solution: it powers up instantly, needs no boot PROM, and resists configuration readback, which improves system security.
Key features include live reprogrammability (the fabric can be reprogrammed without power-cycling in some flows), a low total cost of ownership from eliminating external configuration devices, and 1.5V core operation with low static power. The ProASIC3E variant adds embedded flash blocks and enhanced clocking resources for system-level designs up to approximately 350 MHz internal performance.
Architecturally, the fabric is built from VersaTiles - each configurable as a three-input LUT, or as a D-flip-flop/latch with enable - a unique third-generation flash FPGA structure inherited from the ProASIC family. The FGG256 package is footprint-compatible with the FG484 package, easing migration to higher I/O counts.
Typical applications include industrial control, communications line cards, secure single-chip logic, aerospace/defense systems, and power-up-critical designs where instant-on configuration is required.
Design consideration: flash FPGAs tolerate fewer program/erase cycles than SRAM reconfiguration, so plan reprogramming frequency accordingly; also verify I/O bank voltage assignments before pinout freeze.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE600-FGG256I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE600-FGG256I (gleiche Bauform und Footprint) – abweichend in Package, Configuration Memory, Process Technology, RoHS Status, Reprogrammability.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE600-2FGG256
✅ Drop-In✓ Auf Lager
$33.15 / Stück
Datenblatt ansehen →A3P600-FG256I
✅ Drop-In✓ Auf Lager
$23.1 / Stück
Datenblatt ansehen →M7AFS600-2FGG256I
✅ Drop-In✓ Auf Lager
$389.6 / Stück
Datenblatt ansehen →M1AFS1500-1FG256
✅ Drop-In✓ Auf Lager
$191.42 / Stück
Datenblatt ansehen →M1AFS250-FGG256I
✅ Drop-In✓ Auf Lager
$49.5 / Stück
Datenblatt ansehen →A3PE600-FGG484I
✅ Drop-In✓ Auf Lager
$44.03 / Stück
Datenblatt ansehen →A3PE600-FGG256I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E Flash FPGA |
| System Gates | 600000 gates |
| Logic Elements (VersaTiles) | 13824 |
| User I/O | 165 |
| Embedded Flash Memory | 110592 bits |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Performance | 350 MHz |
| Gehäuse | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Ball Pitch | 1.0 mm |
| Package Height | 1.6 mm |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Montageart | Surface Mount |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) |
| RoHS-Status | Compliant (lead free) |
| Process Technology | CMOS flash FPGA |
| Footprint Compatibility | FG256 and FG484 footprint-compatible packages |
A3PE600-FGG256I 1.6 mm Pinbelegungsleitfaden
Pinbelegung für A3PE600-FGG256I (1.6 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE600-FGG256I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE600-FGG256I ist geeignet für 6 Anwendungs: Industrial Control and Automation, Secure Single-Chip Logic, Aerospace and Defense Systems, Communications Line Cards, Instant-On Battery and Handheld Systems, Test and Measurement Instrumentation.
Industrial Control and Automation
The A3PE600-FGG256I fits industrial control because its non-volatile flash configuration means the controller logic is active the instant 1.5V core power arrives - no boot sequence, no external configuration PROM to fail in electrically noisy factory environments. With 13,824 VersaTiles and 165 user I/Os, it handles motor sequencing, I/O expansion, and protocol bridging (UART, SPI, CAN peripherals implemented in fabric) at up to ~350 MHz internal performance. Place it between sensors and a host MCU or as standalone deterministic logic; the single-chip design reduces BOM and improves MTBF in -40C to +85C cabinets.
Empfohlen
Secure Single-Chip Logic
Flash FPGAs like the A3PE600-FGG256I are preferred for security-sensitive logic because the configuration is stored on-chip in flash and cannot be read back like an SRAM bitstream, and the absence of an external boot flash removes the most commonly attacked component on SRAM-FPGA boards. The 600K-gate fabric and 110,592 bits of embedded flash let designers co-locate encryption keys, look-up tables, and control logic on one chip. This suits authentication engines, secure boot front-ends, and anti-cloning logic in industrial and defense-adjacent products operating from a 1.5V core in the 17 x 17 mm FBGA.
Empfohlen
Aerospace and Defense Systems
In aerospace and defense, the A3PE600-FGG256I's flash-based fabric avoids the configuration-upset behavior of SRAM FPGAs, since there is no volatile bitstream to corrupt, and its single-chip architecture eliminates the configuration device failure point in high-reliability builds. The industrial -40C to +85C rating supports many avionic module environments (verify program-specific qualification), and 165 user I/Os cover bus interfaces, backplane glue logic, and sensor aggregation. Designers should implement TMR and SEU-hardened RTL per Microchip reliability app notes, and confirm the exact speed-grade and screening requirements for the program.
Empfohlen
Communications Line Cards
The ProASIC3E fabric, with 13,824 VersaTiles and ~350 MHz internal performance, handles line-card glue logic: framing, deserializer-to-processor bridging, LED/status control, and backplane handshaking. The 165 user I/Os support multiple I/O banks with per-bank voltage reference assignment - one VREF pin per minibank when using voltage-referenced standards, per the Microchip datasheet - enabling mixed 3.3V/2.5V/1.8V interfaces on a single device. Instant-on flash configuration means the line card is link-ready immediately after hot-swap power-up, and the 17 x 17 mm, 1.0 mm-pitch FBGA keeps board area competitive.
Empfohlen
Instant-On Battery and Handheld Systems
Battery-powered instruments benefit from the A3PE600-FGG256I's near-zero configuration power overhead: the flash fabric requires no configuration energy at each power-up, so a handheld device becomes operational within milliseconds of switch-on, and the 1.5V core keeps active power low at typical glue-logic utilization. The single-chip solution (no boot PROM) saves board space and quiescent budget. With 110,592 bits of embedded flash, calibration constants and unit serial data are stored on-chip. Designers should size decoupling for I/O bank switching currents and confirm static versus dynamic current split in Libero power analysis.
Empfohlen
Test and Measurement Instrumentation
Bench and rack instruments use the A3PE600-FGG256I for timing generation, trigger logic, and front-end sequencing, where the flash FPGA's deterministic instant-on behavior and low jitter supply of clean clocks matter. The 600K-gate fabric implements state machines, counters, and interface translators between USB/LAN modules and analog front ends, while 165 user I/Os provide dense channel connectivity from the 1.0 mm-pitch FBGA. Because reprogrammability allows field firmware updates in-system via JTAG with FlashPro, instruments can be feature-upgraded in the field without configuration-device changes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE600-FGG256I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE600-2FGG256 | A3P600-FG256I | M7AFS600-2FGG256I | M1AFS1500-1FG256 | M1AFS250-FGG256I |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (FGG256), 17 x 17 mm, 1.0 mm pitch | 256-FBGA (FGG256) - same footprint | 256-LBGA (FG256) - same footprint | 256-FBGA - same footprint | 256-FBGA (FG256) - same footprint | 256-FBGA (FGG256) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 gates | 600000 gates | 600000 gates | 600K-class gates | 1500000 gates | 250000 gates |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Flash Memory | 110592 bits | 110592 bits | None (ProASIC3, no E blocks) | Fusion flash fabric (analog + flash) | Fusion flash fabric | Fusion flash fabric |
| Configuration Memory | On-chip flash (single-chip, instant-on) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Wichtigste Unterscheidungsmerkmale
- Embedded flash blocks in the fabric (vs. A3P600-FG256I)
- Identical die, faster speed grade as shortage fallback (vs. A3PE600-2FGG256)
- 1.5V core compatibility in legacy designs (vs. M7AFS600-2FGG256I)
- 165 user I/Os in compact 17 x 17 mm (vs. A3PE600-FGG484I)
Designhinweise
The A3PE600-FGG256I requires a 1.5V core rail plus I/O bank rails (typically 3.3V/2.5V/1.8V depending on I/O standards). Estimated: power consumption scales with toggle rate and utilization - run Microchip's Libero power calculator with your post-fit netlist before finalizing the regulator budget. Because flash FPGAs have near-zero configuration power, inrush is governed by ordinary rail ramp; still provide a clean monotonic 1.5V ramp and local bulk capacitance (e.g., 47uF plus 0.1uF per I/O bank) to handle simultaneous switching output noise.
The FGG256 package has a 1.0 mm ball pitch on a 17 x 17 mm body; use a standard 0.5 mm pad, NSMD geometry, and via-in-pad or dog-bone escape for inner rows. The datasheet states FG256 and FG484 are footprint-compatible families - if you may migrate to FG484 later, reserve board area and verify keep-out. Follow Microchip's ProASIC3E PCB layout guidelines for ball-map fanout and do not swap VREF ball assignments: when using voltage-referenced I/O standards, one I/O per minibank must be reserved as VREF.
Three common mistakes with this part: (1) choosing the commercial-temperature A3PE600-FGG256 for an industrial build - the 'I' suffix is mandatory for -40C to +85C; (2) assuming SRAM-FPGA design flows - use Libero SoC and FlashPro, not third-party SRAM toolchains; (3) freezing the pinout before running I/O bank analysis, which can strand VREF pins. Also verify speed-grade margins after recompiling on a substitute speed grade such as the -2 part.
Estimated: the 256-FBGA's 1.6 mm height plastic package dissipates moderate power at typical utilization. For worst-case junction temperature, use theta-JA from the ProASIC3E datasheet package chapter with your board's copper area; a 4-layer board with solid ground plane typically keeps theta-JA in the 30-40 C/W class for this package size. Verify TJ stays below the datasheet maximum at -40C to +85C ambient plus self-heating; if marginal, add ground-plane copper under the die shadow rather than a heatsink.
Compliance-Informationen
Mouser listing describes A3PE600-FGG256I as LEAD FREE; Jotrin describes the FBGA-256 package as GREEN. REACH, halogen-free, and conflict-minerals status not stated in provided data.
