AFS600-1FGG256 vs M7AFS600-FGG256 Vergleich
Detaillierter Direktvergleich von AFS600-1FGG256 von Microchip Technology und M7AFS600-FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256 ✓ AktivMicrochip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-1FGG256 | M7AFS600-FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| System Gates | 600,000 gates | 600K |
| User I/O | 119 I/O | 119 |
| Versorgungsspannung | 1.5 V | — |
| Logic Family | Flash-based CMOS | — |
| Process Technology | 130 nm CMOS | 130 nm flash-based |
| Metal Layers | 7 layers | — |
| Package Type | 256-ball FBGA | — |
| Package Pin Count | 256 balls | — |
| Package Pitch | 1.0 mm | — |
| Betriebstemperatur | 0°C to 70°C | [DATA_NEEDED: Operating Temperature Range] |
| Configuration Memory | Embedded nonvolatile flash | Flash (single-chip, non-volatile) |
| Power-Up Configuration | Live at power-up | — |
| Integrated Analog Resources | Configurable analog blocks | — |
| Integrated Clock Management | Clock generation and management | — |
| Embedded Memory | Large flash memory blocks | — |
| Package Family | FBGA surface-mount package family | — |
| RoHS-Status | RoHS compliant | [DATA_NEEDED: RoHS Status] |
| Lead-Free Status | Lead-free | — |
| Pin Assignments | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Family | — | Fusion (M7AFS600) |
| Flip-Flops | — | 110592 |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Maximum Frequency | — | 1098.9 MHz (distributor listing) |
| Gehäuse | — | 256-LBGA / 256-FBGA |
| Ball Pitch | — | 1 mm |
| Montageart | — | Surface Mount |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| Packaging | — | Tray |
| MSL-Level | — | [DATA_NEEDED: Moisture Sensitivity Level] |