AFS600-2FGG484 vs M1AFS600-2FG484I Vergleich

Detaillierter Direktvergleich von AFS600-2FGG484 von Microchip Technology und M1AFS600-2FG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
AFS600-2FGG484 AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG484 ✓ Aktiv
Microchip Technology
M1AFS600-2FG484I M1AFS600-2FG484I - Fusion FPGA 600K Gates, 172 I/O | Microchip

M1AFS600-2FG484I - Fusion FPGA 600K Gates, 172 I/O | Microchip

M1AFS600-2FG484I ✓ Aktiv

Spezifikationsvergleich

Parameter AFS600-2FGG484 M1AFS600-2FG484I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Fusion mixed-signal field-programmable gate array (FPGA) —
System Gates 600,000 gates 600K
Logic Elements 110,592 logic elements —
User I/O Count 172 I/O —
Maximum Frequency 1470.59 MHz —
Versorgungsspannung 1.5 V —
Process Technology 130 nm CMOS 130 nm CMOS
Metal Layers 7 layers —
Package Type 484-pin FBGA —
Package Body Size 23 x 23 mm —
Package Pitch 1.0 mm —
Programmable Logic Flash-based programmable logic —
Analog Capability Configurable embedded analog blocks —
Clock Management Comprehensive clock generation and management circuitry —
Configuration Memory Large embedded flash-memory blocks —
Betriebstemperatur 0 °C to +85 °C -40C to +100C (Industrial)
Montageart Surface mount Surface Mount
Packaging Type Tray —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Manufacturer Part Number — M1AFS600-2FG484I
Family — Fusion (Flash FPGA with ARM Cortex-M1)
Logic Cells — 13824
Total RAM Bits — 110592 bits
User I/O — 172
Supply Voltage - Core — 1.5 V (1.425 V to 1.575 V)
Speed Grade — 2
Reference Frequency (per distributor listing) — 1470.59 MHz
Gehäuse — 484-FBGA, 23x23 mm
Configuration Technology — Flash (non-volatile, instant-on)
Packaging — Tray
RoHS-Status — [DATA_NEEDED: RoHS status]
MSL-Level — [DATA_NEEDED: moisture sensitivity level]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern