M1AFS600-2FG484I - Fusion FPGA 600K Gates, 172 I/O | Microchip
Teilenummer: M1AFS600-2FG484I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $119.8 | $11.980,00 |
| 500 | $108.4 | $54.200,00 |
| 1.000 | $97.6 | $97.600,00 |
M1AFS600-2FG484I Übersicht
An FPGA (field-programmable gate array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program after manufacturing to implement custom digital circuits. FPGAs sit within the broader programmable-logic hierarchy of the semiconductor industry, alongside CPLDs, ASSPs, and ASICs, and the Fusion family is Microchip's (formerly Actel/Microsemi) mixed-signal flash-based FPGA line distinguished by integrating an ARM Cortex-M1 hard processor core alongside programmable logic.
Key features of the M1AFS600-2FG484I include 600,000 system gates of flash-based programmable fabric, 172 configurable user I/O pins, and 110592 bits of embedded RAM, all manufactured on a 130nm CMOS flash process. The flash-based fabric is inherently non-volatile, giving it instant-on behavior and superior security against bitstream interception compared with SRAM FPGAs, which require external configuration storage. The industrial-grade I temperature suffix supports operation from -40C to +100C per distributor listings, suiting harsh environments.
The defining architectural advantage of the M1AFS600 variant is the integrated ARM Cortex-M1 soft/hard processor support within the Fusion fabric, enabling single-chip embedded control plus custom logic, reducing board area and inter-chip latency. Distributor listings also cite a 1470.59 MHz reference figure for this device family. The 484-ball FBGA with 0.1 cm ball pitch density fits mixed-signal designs such as power sequencing, motor control, and system management.
Typical applications include industrial automation and motor control, aerospace and defense embedded processing, power management and smart energy systems, and general-purpose embedded control where non-volatile instant-on FPGA fabric with ARM processing is required.
Design-wise, verify the 1.425V to 1.575V core supply window with a regulated rail and observe Microchip/Microsemi Flash FPGA layout guidelines for FBGA decoupling and bank I/O standards.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für M1AFS600-2FG484I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS600-2FG484I (gleiche Bauform und Footprint) – abweichend in Package, Family, Process Technology, Configuration Memory, System Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
AFS600-2FGG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS600-2FGG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AFS600-1FG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS600-1FGG484K
✅ Drop-In✓ Auf Lager
$155 / Stück
Datenblatt ansehen →M7AFS600-FGG484I
✅ Drop-In✓ Auf Lager
$219.2 / Stück
Datenblatt ansehen →M1AFS600-2FG484I Grenzwerte & elektrische Eigenschaften
| Manufacturer Part Number | M1AFS600-2FG484I |
| Family | Fusion (Flash FPGA with ARM Cortex-M1) |
| System Gates | 600K |
| Logic Cells | 13824 |
| Total RAM Bits | 110592 bits |
| User I/O | 172 |
| Supply Voltage - Core | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm CMOS |
| Speed Grade | 2 |
| Reference Frequency (per distributor listing) | 1470.59 MHz |
| Gehäuse | 484-FBGA, 23x23 mm |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Configuration Technology | Flash (non-volatile, instant-on) |
| Packaging | Tray |
M1AFS600-2FG484I 484-fbga, 23x23 mm Pinbelegungsleitfaden
Pinbelegung für M1AFS600-2FG484I (484-fbga, 23x23 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS600-2FG484I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS600-2FG484I ist geeignet für 6 Anwendungs: Industrial Automation and Motor Control, Aerospace and Defense Embedded Processing, Smart Power and Energy Management, Embedded System Control with ARM Processing, Secure and Instant-On Systems, Test, Measurement and Protocol Bridging.
Industrial Automation and Motor Control
The M1AFS600-2FG484I fits industrial automation because its 600K-gate flash fabric and ARM Cortex-M1 processor integrate motion sequencing, PWM generation, and protocol bridging in one 484-FBGA device. With 172 user I/O, it directly drives encoder interfaces, ADC front ends, and fieldbus transceivers without external glue logic. Because the flash configuration is non-volatile and instant-on, drives and PLC modules boot deterministically without external configuration memory - a key advantage over SRAM FPGAs in factory equipment that must restart safely after power dips. The industrial -40C to +100C rating covers cabinet and motor-drive thermal environments.
Empfohlen
Aerospace and Defense Embedded Processing
Defense subsystems favor the M1AFS600-2FG484I because Actel/Microsemi-origin flash FPGAs are inherently non-volatile and resistant to bitstream interception, unlike SRAM FPGAs that load configuration from external flash at every power-up. The ARM Cortex-M1 core handles telemetry and housekeeping while the 600K-gate fabric implements custom interfaces, and the 484-FBGA provides 172 I/O for backplane and sensor routing. The industrial temperature rating plus Microchip's heritage in rad-tolerant families makes migration paths available. Designs should verify program-specific screening and environmental requirements independently with Microchip.
Empfohlen
Smart Power and Energy Management
The Fusion family was architected specifically for smart power control, so the M1AFS600-2FG484I is a natural fit for power sequencing, energy metering, and battery management controllers. Its mixed-signal heritage pairs the ARM Cortex-M1 with analog-oriented fabric resources, while 600K gates implement multi-channel PWM, soft-start state machines, and digital protection comparators. The 110592-bit embedded RAM buffers metering samples and event logs. Instant-on flash configuration means power rails are supervised from the first millisecond after brownout - a requirement SRAM FPGAs cannot meet without external configuration devices.
Empfohlen
Embedded System Control with ARM Processing
When a design needs a microcontroller plus custom logic, the M1AFS600-2FG484I eliminates the classic two-chip MCU+FPGA split. The ARM Cortex-M1 runs firmware while the 600K-gate fabric implements peripherals that do not exist on standard MCUs - custom serial engines, deterministic logic interfaces, or proprietary accelerators. On-chip fabric-to-processor coupling removes off-chip bus latency between MCU and FPGA, and 172 user I/O host both firmware-driven and fabric-driven signals. Non-volatile flash startup means the system runs firmware immediately with no configuration controller or boot ROM negotiation.
Empfohlen
Secure and Instant-On Systems
The M1AFS600-2FG484I suits applications where configuration security and boot time are critical: network appliances, secure gateways, and anti-tamper systems. Flash-based fabric stores the bitstream on-chip, eliminating the external configuration flash that exposes SRAM FPGAs to bitstream cloning and bus-snooping attacks, and removing 10-100 ms of configuration delay at power-up. For always-on infrastructure equipment, the 1.5V core supply (1.425V to 1.575V) keeps power budget predictable, and the 484-FBGA's 23x23 mm footprint packs 600K gates and 172 I/O into a dense surface-mount package.
Empfohlen
Test, Measurement and Protocol Bridging
Instrument makers use the M1AFS600-2FG484I as a configurable protocol bridge and timing engine: the 600K-gate fabric implements UART/SPI/I2C to custom bus translation, trigger state machines, and timestamping at fabric speed, while the ARM Cortex-M1 handles USB or Ethernet command parsing and housekeeping. The 110592-bit embedded RAM captures trace buffers, and 172 I/O fan out to front-panel connectors and ADC/DAC chips. Distributor listings cite a 1470.59 MHz family reference figure, reflecting the timing resolution achievable in the fabric for TDC-style measurement circuits.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS600-2FG484I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | AFS600-2FGG484I | M1AFS600-2FGG484I | AFS600-1FG484I | M7AFS600-FGG484I |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/O | 172 | 172 | 172 | 172 | 172 |
| Lead-Free / Green Ball | No (standard FG) | Yes (FGG) | Yes (FGG) | No (FG) | Yes (FGG) |
| Operating Temperature | -40C to +100C (Industrial) | Industrial | Industrial | Industrial | Industrial |
Wichtigste Unterscheidungsmerkmale
- Integrated ARM Cortex-M1 processor in flash fabric (vs. AFS600-2FGG484I)
- Cost-optimized speed grade (vs. M1AFS600-1FGG484K)
- Instant-on non-volatile flash configuration (vs. SRAM FPGAs (Xilinx/AMD Artix-7 class))
Designhinweise
Power the M1AFS600-2FG484I core from a regulated 1.5V rail held within 1.425V to 1.575V (per distributor specification data). Use a low-noise LDO or wide-input DC-DC followed by an LC filter, and follow Microchip's Fusion power-up sequencing requirements for auxiliary and I/O rails. Because flash FPGAs draw startup current differently from SRAM FPGAs (no configuration fetch), size the bulk capacitance for steady-state fabric switching current rather than inrush. Estimate: at moderate fabric utilization, allow headroom for at least 2x nominal core current in the 1.5V converter.
For the 484-ball FBGA (23x23 mm), place a 0.1 uF ceramic decoupling capacitor at every power/ground ball pair on the underside of the board, plus bulk capacitance at the board edge. Fan out with via-in-pad or dog-bone escapes on 0.8 mm pitch as appropriate, and dedicate complete internal planes to core and I/O grounds to control simultaneous switching noise across the 172 user I/O. Follow Microchip's Fusion FPGA PCB layout application notes for bank grouping and ball-mapped power assignment.
Do not interchange FG (standard ball) and FGG (green/lead-free ball) suffixes casually in a RoHS-regulated BOM - the M1AFS600-2FG484I uses standard FG ball metallurgy, so compliance-driven programs should specify the FGG variant instead. Also remember that M1AFS600-1FGG484K is speed grade 1 while this part is speed grade 2: design timing margins against grade 2, or recompile and re-verify when substituting across speed grades in the same 484 footprint.
Compliance-Informationen
Standard FG suffix indicates non-green ball metallurgy; the FGG variants (e.g., AFS600-2FGG484I) denote lead-free/green. Confirm RoHS/REACH status with Microchip for the exact ordering code before specifying in compliant programs.
