AFS600-FG256K vs M7AFS600-FG256I Vergleich
Detaillierter Direktvergleich von AFS600-FG256K von Microchip Technology und M7AFS600-FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-FG256K | M7AFS600-FG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| System Gates | 600,000 system gates | 600K |
| Logic Cells | 13,824 logic cells | — |
| Device Type | Fusion mixed-signal FPGA | — |
| Programmable Logic | Flash-based CMOS programmable logic | — |
| Configuration Technology | Nonvolatile flash configuration | — |
| Power-Off Retention | Program retained when powered off | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 metal layers | — |
| Logic Family | CMOS | — |
| Versorgungsspannung | 1.5 V | — |
| Betriebstemperaturbereich | 0°C to 70°C | — |
| Package Type | BGA-256, 1.0 mm pitch | — |
| Pin-Anzahl | 256 pins | — |
| Montageart | Surface mount | — |
| ARM Support | Optional ARM support in the Fusion family | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Gehäuse / Bauform | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Montagestil | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |