AFS600-FG256K vs M7AFS600-FG256I 对比

详细并排对比 AFS600-FG256K 出自 Microchip Technology 和 M7AFS600-FG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
AFS600-FG256K AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K ✓ 量产中
Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 量产中

规格对比

参数 AFS600-FG256K M7AFS600-FG256I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
System Gates 600,000 system gates 600K
Logic Cells 13,824 logic cells —
Device Type Fusion mixed-signal FPGA —
Programmable Logic Flash-based CMOS programmable logic —
Configuration Technology Nonvolatile flash configuration —
Power-Off Retention Program retained when powered off —
Power-Up Behavior Live at Power-Up (LAPU) —
Process Technology 130 nm CMOS 130 nm
Metal Layers 7 metal layers —
Logic Family CMOS —
电源电压 1.5 V —
工作温度范围 0°C to 70°C —
Package Type BGA-256, 1.0 mm pitch —
引脚数量 256 pins —
安装类型 Surface mount —
ARM Support Optional ARM support in the Fusion family —
Series — M7AFS600 (Fusion)
Logic Capacity (DigiKey listing) — 110592
Number of I/O — 119 I/O
Embedded Processor — ARM CoreMP7
Core Supply Voltage — 1.5 V
封装 / 外壳 — 256-LBGA (FBGA)
Terminal Form — Ball
Package Shape — Square
安装方式 — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Packaging — Tray
Programmable Logic Type — Flash-based, non-volatile
Analog Integration — Mixed-signal (configurable analog + flash memory)

数据手册与资源

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