AFS600-FGG256I vs M7AFS600-FGG256 Vergleich
Detaillierter Direktvergleich von AFS600-FGG256I von Microchip Technology und M7AFS600-FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-FGG256I ✓ AktivMicrochip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-FGG256I | M7AFS600-FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| System Gates | 600,000 gates | 600K |
| Device Type | Fusion mixed-signal FPGA | — |
| Process Technology | 130 nm CMOS | 130 nm flash-based |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash | Flash (single-chip, non-volatile) |
| Power-Up Configuration | Live at Power-Up (LAPU) | — |
| System Performance Frequency | 350 MHz | — |
| Versorgungsspannung | 1.5 V | — |
| Logic Family | CMOS | — |
| Total Pin Count | 256 pins | — |
| Package Type | BGA-256 | — |
| Package Pitch | 1.0 mm | — |
| Package Form | Square | — |
| Terminal Type | Ball | — |
| Betriebstemperatur | 0°C to +70°C | [DATA_NEEDED: Operating Temperature Range] |
| Temperature Grade | Industrial | — |
| Programmable Analog Resources | Configurable analog blocks | — |
| Embedded Flash | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Programming Interface | [DATA_NEEDED: programming interface] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Maximum I/O Current | [DATA_NEEDED: maximum I/O current] | — |
| Junction Temperature | [DATA_NEEDED: junction temperature rating] | — |
| Family | — | Fusion (M7AFS600) |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Maximum Frequency | — | 1098.9 MHz (distributor listing) |
| Gehäuse | — | 256-LBGA / 256-FBGA |
| Ball Pitch | — | 1 mm |
| Montageart | — | Surface Mount |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| Packaging | — | Tray |
| RoHS-Status | — | [DATA_NEEDED: RoHS Status] |
| MSL-Level | — | [DATA_NEEDED: Moisture Sensitivity Level] |