ATSAM4S-EK2 vs ATSAM4SD32CB-CFN Vergleich

Detaillierter Direktvergleich von ATSAM4S-EK2 von Microchip Technology und ATSAM4SD32CB-CFN von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAM4S-EK2 ATSAM4S-EK2 - SAM4SD32C Cortex-M4 Eval Kit | Microchip

ATSAM4S-EK2 - SAM4SD32C Cortex-M4 Eval Kit | Microchip

ATSAM4S-EK2 Obsolete
Microchip Technology
ATSAM4SD32CB-CFN ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip

ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip

ATSAM4SD32CB-CFN ✓ Aktiv

Spezifikationsvergleich

Parameter ATSAM4S-EK2 ATSAM4SD32CB-CFN
Marke Microchip Technology Microchip Technology
Kategorie Development Boards Microcontrollers
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $260,00 $6,05
Manufacturer Microchip Technology (formerly Atmel) —
Series AT91SAM4 / SAM4S —
Target MCU SAM4SD32C —
Core ARM Cortex-M4 32-bit —
Core Features DSP extensions, single-precision FPU —
Maximum CPU Clock 120 MHz 120 MHz
On-chip Flash 2048 KB —
On-chip SRAM 160 KB —
External Memory On-board NAND Flash —
Low-frequency Crystal 32.768 kHz —
Main Crystal 12 MHz —
Communication Ethernet MAC, USB 2.0 FS, 2x CAN, USART, UART, SPI, TWI/I2C, I2S —
ADC 12-bit 12-bit, up to 16 channels
Display Interface TFT LCD connector —
On-board Debugger SAM-ICE / Atmel-ICE compatible JTAG + CDC —
Form Factor Embedded MCU / DSP Evaluation Board —
Packaging Box / Bulk —
Product Status (Octopart) Obsolete —
Core Architecture — ARM Cortex-M4 with FPU and MPU
Flash Memory — 2 MB (2048 KB)
SRAM — 160 KB
Cache — Up to 4 KB (Flash controller cache)
Core Mark / DMIPS — 1.25 DMIPS/MHz (150 DMIPS at 120 MHz)
Operating Voltage (VDDIO/VDDIN) — 1.62 V to 3.6 V
Core Voltage (internal) — 1.2 V (internal LDO)
USB Interface — Full-speed USB Device with on-chip transceiver
Communication Interfaces — 5x USART, 3x SPI, 2x TWI (I2C), 1x HS USB, 1x CAN, 1x SSC, 1x EMAC
DMA Channels — 16 peripheral DMA channels
Timers — Two 16-bit TC channels, one 16-bit PWM, one RTC, one RTT
Gehäuse — 100-ball VFBGA, 7x7 mm, 0.65 mm pitch
Montageart — Surface Mount
Operating Temperature (Grade) — -40C to +85C (industrial)
MSL-Level — 3 (per JEDEC J-STD-020, reflow at 260C)
RoHS-Status — Compliant (Pb-free)
Lead-free / Halogen-free — Lead-free (green) per Microchip data

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