ATSAM4S-WPIR-RD vs ATSAM4CP16C-EK Vergleich

Detaillierter Direktvergleich von ATSAM4S-WPIR-RD von Microchip Technology und ATSAM4CP16C-EK von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAM4S-WPIR-RD ATSAM4S-WPIR-RD - SAM4S16 PIR Camera Reference Design | Microchip

ATSAM4S-WPIR-RD - SAM4S16 PIR Camera Reference Design | Microchip

ATSAM4S-WPIR-RD ✓ Aktiv
Microchip Technology
ATSAM4CP16C-EK ATSAM4CP16C-EK - SAM4CP Dual Cortex-M4 Eval Board | Microchip

ATSAM4CP16C-EK - SAM4CP Dual Cortex-M4 Eval Board | Microchip

ATSAM4CP16C-EK Obsolete

Spezifikationsvergleich

Parameter ATSAM4S-WPIR-RD ATSAM4CP16C-EK
Marke Microchip Technology Microchip Technology
Kategorie Development Boards Development Boards
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $218,00 $0,00
Product Type Reference Design / Evaluation Board MCU 32-Bit Evaluation Board
Target MCU ATSAM4S16C (ARM Cortex-M4) —
Core Architecture ARM Cortex-M4 with Thumb-2 and DSP instruction set —
Maximum CPU Frequency 120 MHz —
Cache Memory 2 Kbytes —
Memory Protection Unit (MPU) Yes —
DSP Instruction Set Yes —
External SRAM 1 Mbyte —
Low-Frequency Crystal 32.768 kHz —
Main Oscillator 12 MHz —
On-Board LDO Regulator Yes —
Image Sensor Interface Yes —
PIR Sensor Interface Yes —
ZigBee Module Connector Yes —
LCD Interface Yes —
JTAG Debug Connector Yes —
Battery Holder Yes —
Pin-to-Pin Compatibility SAM3N, SAM3S families —
Series AT91SAM SAM4CP
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS Status]
Target Device — ATSAM4CP16C (SAM4CP series)
Core — Dual-core 32-bit ARM Cortex-M4
Core Speed — 120 MHz per core
Flash Memory — 1 MB embedded
SRAM — 128 KB plus on-chip cache
Crypto Engine — Advanced cryptographic engine
PLC Modem — G3-PLC modem
PLC Profiles — CENELEC, ARIB, FCC
Supported Standards — G3-PLC specification
Architecture — Stacked dies (per distributor data)
Board Category — Embedded MCU, DSP Evaluation Boards
Packaging — Box
Betriebstemperatur — [DATA_NEEDED: Operating Temperature]
Board Dimensions — [DATA_NEEDED: Board Dimensions]

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