ATSAM4S-XPRO vs ATSAM4SD32CB-CFN Vergleich

Detaillierter Direktvergleich von ATSAM4S-XPRO von Microchip Technology und ATSAM4SD32CB-CFN von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAM4S-XPRO ATSAM4S-XPRO - SAM4S Xplained Pro ARM Cortex-M4 Eval Kit | Microchip

ATSAM4S-XPRO - SAM4S Xplained Pro ARM Cortex-M4 Eval Kit | Microchip

ATSAM4S-XPRO ✓ Aktiv
Microchip Technology
ATSAM4SD32CB-CFN ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip

ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip

ATSAM4SD32CB-CFN ✓ Aktiv

Spezifikationsvergleich

Parameter ATSAM4S-XPRO ATSAM4SD32CB-CFN
Marke Microchip Technology Microchip Technology
Kategorie Development Boards Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $84,96 $6,05
Target MCU ATSAM4SD32C —
Core ARM Cortex-M4 with FPU —
Core Architecture 32-bit ARM Cortex-M4 with FPU and MPU
Maximum CPU Clock 120 MHz 120 MHz
Embedded Flash 2 MB —
SRAM 160 KB 160 KB
On-board External Memory 2 GB NAND Flash —
Target MCU Package LQFP-100 —
Board Host Interface USB Micro-B (power + debug) —
On-board Debugger EDBG (Embedded Debugger) —
Debugger Functions Drag-and-drop programming, Virtual COM Port —
Extension Headers 3 x Xplained Pro extension connectors —
Operating System Support Windows 7 / Windows XP / Linux (via Microchip Studio / Studio 7) —
RoHS Compliance RoHS Compliant —
Board Type Evaluation / Development Board (no extension boards included) —
Flash Memory — 2 MB (2048 KB)
Cache — Up to 4 KB (Flash controller cache)
Core Mark / DMIPS — 1.25 DMIPS/MHz (150 DMIPS at 120 MHz)
Operating Voltage (VDDIO/VDDIN) — 1.62 V to 3.6 V
Core Voltage (internal) — 1.2 V (internal LDO)
USB Interface — Full-speed USB Device with on-chip transceiver
ADC — 12-bit, up to 16 channels
Communication Interfaces — 5x USART, 3x SPI, 2x TWI (I2C), 1x HS USB, 1x CAN, 1x SSC, 1x EMAC
DMA Channels — 16 peripheral DMA channels
Timers — Two 16-bit TC channels, one 16-bit PWM, one RTC, one RTT
Gehäuse — 100-ball VFBGA, 7x7 mm, 0.65 mm pitch
Montageart — Surface Mount
Operating Temperature (Grade) — -40C to +85C (industrial)
MSL-Level — 3 (per JEDEC J-STD-020, reflow at 260C)
RoHS-Status — Compliant (Pb-free)
Lead-free / Halogen-free — Lead-free (green) per Microchip data

Datenblätter & Ressourcen

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