ATSAMA5D22B-CNR vs ATSAMA5D26B-CNR Vergleich
Detaillierter Direktvergleich von ATSAMA5D22B-CNR von Microchip Technology und ATSAMA5D26B-CNR von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip
ATSAMA5D22B-CNR ✓ AktivMicrochip Technology
ATSAMA5D26B-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip
ATSAMA5D26B-CNR ✓ AktivSpezifikationsvergleich
| Parameter | ATSAMA5D22B-CNR | ATSAMA5D26B-CNR |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7,21 | $9,10 |
| Architecture | ARM Cortex-A5 (ARMv7-A) | — |
| Core Count | 1 | 1 |
| Data Width | 32-bit | — |
| Maximale Taktfrequenz | 500 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 128 KB (configurable as SRAM) | — |
| NEON Media Processing Engine | Yes | — |
| Floating Point Unit | Yes | — |
| ARM TrustZone | Yes | — |
| Peripheral Touch Controller (PTC) | Yes | — |
| Embedded Audio Subsystem | Yes (I2S/TDM) | — |
| Gehäuse | 196-TFBGA (11x11x1.2 mm) | 289-LFBGA (14x14x1.4 mm) |
| Ball Pitch | 0.8 mm | 0.8 mm |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +105C (extended) | -40C to +85C (Industrial) |
| Packaging | Tape & Reel (T&R) | — |
| RoHS-Status | Compliant | Compliant |
| Core Architecture | — | Arm Cortex-A5 (Armv7-A) with NEON and FPU |
| Maximum Core Frequency | — | 500 MHz |
| Internal SRAM | — | 128 KB |
| External Memory Support | — | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC, NAND |
| Graphics Controller | — | 2D LCD controller, up to 2048x2048 |
| Ethernet | — | 2x EMAC with IEEE 1588 (10/100 Mbps) |
| USB | — | USB 2.0 High-Speed Host and Device |
| Serial Interfaces | — | 6x FLEXCOM (USART/SPI/TWI), 2x CAN-FD |
| Audio | — | Embedded audio subsystem (SSC, I2S) |
| Security | — | Crypto accelerator, secure boot, tamper detection, TRNG |
| MSL-Level | — | 3 |