ATSAMA5D27C-D1G-CUR vs ATSAMA5D27A-CUR Vergleich
Detaillierter Direktvergleich von ATSAMA5D27C-D1G-CUR von Microchip Technology und ATSAMA5D27A-CUR von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
ATSAMA5D27C-D1G-CUR - 500MHz Cortex-A5 MPU 1Gbit DDR2 SiP | Microchip
ATSAMA5D27C-D1G-CUR ✓ AktivSpezifikationsvergleich
| Parameter | ATSAMA5D27C-D1G-CUR | ATSAMA5D27A-CUR |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,05 | $12,95 |
| Core Architecture | ARM Cortex-A5 (32-bit, single-core) | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 KB | 32 KB |
| L1 Data Cache | 32 KB | 32 KB |
| Integrated DRAM | 1 Gbit DDR2 SDRAM (SiP) | — |
| External Memory Controller | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3, plus QSPI and e.MMC | — |
| Gehäuse | 289-TFBGA (14x14 mm, 0.8 mm pitch) | 289-LFBGA (14x14 mm) |
| Supply Voltage (Core) | 1.2 V (typical) | — |
| Betriebstemperatur | -40 C to +85 C (industrial) | -40 C to +85 C (Industrial, MRLA marking) |
| Ethernet | 1x RGMII + 1x RMII (Gigabit-capable EMAC) | — |
| USB | 2x HS USB (one Host, one Device) | — |
| CAN | 2x CAN-FD controllers | — |
| Flexible Serial (FLEXCOM) | 3x (USART/SPI/TWI configurable) | — |
| Image Sensor Interface (ISI) | Up to 24-bit parallel camera input | — |
| Touch Controller | Peripheral Touch Controller (PTC) | — |
| Audio Subsystem | Embedded SSC + sample-rate converters | — |
| Cryptography | AES, SHA, TRNG, secure boot, monotonic counters | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL rating] | 3 |
| RoHS-Status | Compliant | Compliant |
| Series | — | SAMA5D2 |
| Core | — | ARM Cortex-A5 (1 core, 32-bit) |
| Maximum Junction Temperature | — | 105 C |
| Ball Pitch | — | 0.8 mm |
| External Memory Support | — | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| Cache | — | 32 KB I-cache, 32 KB D-cache |
| FPU / NEON | — | Yes (VFPv4 + NEON) |
| AES-OTF (On-The-Fly) | — | Yes |
| CAN-FD Controllers | — | 2 |
| HSIC Interface | — | Yes |
| Peripheral Touch Controller | — | Yes (PTC) |
| Backup Mode Current | — | 5 uA (typ) |
| Packaging | — | Tape & Reel (TR) |
| Embedded Audio Subsystem | — | Yes (I2S/TDM) |