BCM2835IPPG vs BCM2837RIFBGT Vergleich
Detaillierter Direktvergleich von BCM2835IPPG von Broadcom und BCM2837RIFBGT von Broadcom. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | BCM2835IPPG | BCM2837RIFBGT |
|---|---|---|
| Marke | Broadcom | Broadcom |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $29,91 |
| CPU Core | ARM1176JZF-S (ARM11) | ARM Cortex-A53 |
| Core Frequency | 700 MHz | 1.2 GHz |
| GPU | VideoCore IV | Broadcom VideoCore IV |
| Gehäuse | Small BGA (per Veswin product page) | — |
| Betriebstemperaturbereich | -40C to +105C (TA) | — |
| Peripherals | Timers, Interrupt controller, GPIO, USB, PCM/I2S | — |
| GPIO Count | [DATA_NEEDED: GPIO count] | — |
| SDRAM Interface | [DATA_NEEDED: SDRAM interface details] | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: core/IO supply voltage] |
| USB Interface | [DATA_NEEDED: USB interface version/details] | — |
| Video Decode | [DATA_NEEDED: video codec support] | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Ball Count | [DATA_NEEDED: ball count] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS compliant (per JLCPCB part listing for family part BCM2837RIFBG) |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Datasheet Length | 205 pages | — |
| Number of Cores | — | 4 |
| Architecture | — | ARMv8-A, 64-bit |
| Product Type | — | Application Processor SoC |
| Package Type | — | BGA |
| Package Code (datasheet) | — | [DATA_NEEDED: BGA ball count / package drawing] |
| On-chip Peripherals | — | GPIO, UART, SPI, I2C, PWM, USB (per BCM283x ARM Peripherals datasheet) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tape and Reel (-T suffix) |
| Typical Platform | — | Raspberry Pi 3 series |
| Related SiP | — | RP3A0 (BCM2837 die + 512 MB DRAM, Raspberry Pi Zero 2 W) |