BCM2835IPPG vs BCM2837RIFBGT 비교
다음의 상세 나란히 비교: BCM2835IPPG 제조: Broadcom 및 BCM2837RIFBGT 제조: Broadcom. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | BCM2835IPPG | BCM2837RIFBGT |
|---|---|---|
| 브랜드 | Broadcom | Broadcom |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $0.00 | $29.91 |
| CPU Core | ARM1176JZF-S (ARM11) | ARM Cortex-A53 |
| Core Frequency | 700 MHz | 1.2 GHz |
| GPU | VideoCore IV | Broadcom VideoCore IV |
| 패키지 | Small BGA (per Veswin product page) | — |
| 동작 온도 범위 | -40C to +105C (TA) | — |
| Peripherals | Timers, Interrupt controller, GPIO, USB, PCM/I2S | — |
| GPIO Count | [DATA_NEEDED: GPIO count] | — |
| SDRAM Interface | [DATA_NEEDED: SDRAM interface details] | — |
| 공급 전압 | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: core/IO supply voltage] |
| USB Interface | [DATA_NEEDED: USB interface version/details] | — |
| Video Decode | [DATA_NEEDED: video codec support] | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Ball Count | [DATA_NEEDED: ball count] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | RoHS compliant (per JLCPCB part listing for family part BCM2837RIFBG) |
| MSL 레벨 | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Datasheet Length | 205 pages | — |
| Number of Cores | — | 4 |
| Architecture | — | ARMv8-A, 64-bit |
| Product Type | — | Application Processor SoC |
| Package Type | — | BGA |
| Package Code (datasheet) | — | [DATA_NEEDED: BGA ball count / package drawing] |
| On-chip Peripherals | — | GPIO, UART, SPI, I2C, PWM, USB (per BCM283x ARM Peripherals datasheet) |
| 동작 온도 | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tape and Reel (-T suffix) |
| Typical Platform | — | Raspberry Pi 3 series |
| Related SiP | — | RP3A0 (BCM2837 die + 512 MB DRAM, Raspberry Pi Zero 2 W) |