BSC9131NLN1HHHB vs BSC9131NJN1HHHB557 Vergleich
Detaillierter Direktvergleich von BSC9131NLN1HHHB von NXP Semiconductors und BSC9131NJN1HHHB557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | BSC9131NLN1HHHB | BSC9131NJN1HHHB557 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Unknown | Aktiv |
| Product Type | QorIQ Qonverge system-on-chip | — |
| Processor Core | PowerPC e500, 32-bit | — |
| Processor Frequency | 800 MHz | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Digital Signal Processor | 800 MHz StarCore DSP | — |
| Accelerator | MAPLE-B2F accelerator | — |
| Communications Interface | Integrated IFC | — |
| External Memory Support | DDR3 | — |
| Betriebstemperaturbereich | 0°C to 105°C | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 520-FCBGA (21 mm x 21 mm) | — |
| Pin-Anzahl | 520 balls | — |
| Montageart | Surface mount | Surface Mount |
| Architecture | 32-bit | — |
| Qualification | Military and defense target application; qualification status [DATA_NEEDED: exact device qualification status] | — |
| RoHS-Status | RoHS compliant | Compliant |
| Packaging Form | Multiple dry pack, bakeable tray | — |
| Observed LCSC Price | $36.6899 as of 2026-10-23 | — |
| Observed Heisener Price | $56.6250 per unit as of 2026-10-23 | — |
| Observed Heisener Stock | 4,928 pieces as of 2026-10-23 | — |
| Processor Type | — | QorIQ Qonverge multicore baseband processor |
| Processor Category | — | Embedded MPU / communications processor |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Wärmewiderstand | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Lebenszyklusstatus | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |