BSC9131NLN1HHHB vs BSC9131NJN1HHHB557 对比
详细并排对比 BSC9131NLN1HHHB 出自 NXP Semiconductors 和 BSC9131NJN1HHHB557 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | BSC9131NLN1HHHB | BSC9131NJN1HHHB557 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Unknown | 有效 |
| Product Type | QorIQ Qonverge system-on-chip | — |
| Processor Core | PowerPC e500, 32-bit | — |
| Processor Frequency | 800 MHz | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Digital Signal Processor | 800 MHz StarCore DSP | — |
| Accelerator | MAPLE-B2F accelerator | — |
| Communications Interface | Integrated IFC | — |
| External Memory Support | DDR3 | — |
| 工作温度范围 | 0°C to 105°C | [DATA_NEEDED: operating temperature range] |
| 封装 | 520-FCBGA (21 mm x 21 mm) | — |
| 引脚数量 | 520 balls | — |
| 安装类型 | Surface mount | Surface Mount |
| Architecture | 32-bit | — |
| Qualification | Military and defense target application; qualification status [DATA_NEEDED: exact device qualification status] | — |
| RoHS 状态 | RoHS compliant | Compliant |
| Packaging Form | Multiple dry pack, bakeable tray | — |
| Observed LCSC Price | $36.6899 as of 2026-10-23 | — |
| Observed Heisener Price | $56.6250 per unit as of 2026-10-23 | — |
| Observed Heisener Stock | 4,928 pieces as of 2026-10-23 | — |
| Processor Type | — | QorIQ Qonverge multicore baseband processor |
| Processor Category | — | Embedded MPU / communications processor |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| 热阻 | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| 生命周期状态 | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |