EDB5432BEBH-1DAUT-F-D vs EDB1332BDBH-1DAUT-F-D Vergleich
Detaillierter Direktvergleich von EDB5432BEBH-1DAUT-F-D von Micron Technology und EDB1332BDBH-1DAUT-F-D von Micron Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Micron Technology
EDB5432BEBH-1DAUT-F-D - 512Mb LPDDR2 DRAM 533MHz | Micron
EDB5432BEBH-1DAUT-F-D ✓ AktivMicron Technology
EDB1332BDBH-1DAUT-F-D - 1Gbit LPDDR2 533MHz | Micron
EDB1332BDBH-1DAUT-F-D ✓ AktivSpezifikationsvergleich
| Parameter | EDB5432BEBH-1DAUT-F-D | EDB1332BDBH-1DAUT-F-D |
|---|---|---|
| Marke | Micron Technology | Micron Technology |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,45 | $2,16 |
| Speichertyp | Mobile LPDDR2 SDRAM | SDRAM - Mobile LPDDR2 |
| Speichergröße | 512 Mbit | 1 Gbit |
| Speicherorganisation | 16M x 32 | 32M x 32 |
| Clock Frequency | 533 MHz | 533 MHz |
| Supply Voltage Range | 1.14 V to 1.95 V | 1.14 V to 1.95 V |
| Core Voltage | 1.2 V (typical, LPDDR2) | — |
| Schnittstelle | Parallel | Parallel |
| Gehäuse | 134-VFBGA (10 x 11.5 mm) | 134-VFBGA (10 x 11.5 mm) |
| Montageart | Surface Mount | Surface Mount |
| Temperature Grade | Automotive | Automotive |
| Terminals | 134 balls | — |
| Terminal Form | Ball (VFBGA) | — |
| Package Shape | Rectangular | Rectangular |
| RoHS Code | Yes (D suffix, lead-free) | — |
| Part Life Cycle Code | Active | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Access Time / CAS Latency | [DATA_NEEDED: CAS latency] | — |
| Standard Qty per Reel/Tray | [DATA_NEEDED: packaging standard quantity] | — |
| Core Supply Voltage | — | 1.2 V |
| Access Mode | — | Single Bank Page Burst |
| Number of Terminals | — | 134 |
| Packaging Suffix | — | -D (Dry Pack) |
| Moisture Sensitivity | — | Dry Pack (per -D suffix) |