EP1C12F256C6 vs EP1C12F256C7 Vergleich
Detaillierter Direktvergleich von EP1C12F256C6 von Intel und EP1C12F256C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C12F256C6 | EP1C12F256C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $48,29 | $46,30 |
| Series | Cyclone I | Cyclone |
| Logic Elements | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | 1,206 |
| Embedded RAM Bits | 239,616 bits (52 M4K blocks) | — |
| Embedded 18x18 Multipliers | 17 | — |
| Maximum User I/Os | 185 | — |
| PLLs | 2 | 2 |
| Process Technology | 130 nm SRAM, 1.5 V core | 130 nm |
| Gehäuse | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA (FBGA-256) |
| Betriebstemperatur | 0C to +85C (commercial, C6 speed grade) | 0C to +85C (Commercial, 'C' suffix) |
| Speed Grade | C6 (mid-tier) | 7 |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI | — |
| LVDS Data Rate | Up to 640 Mbps | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone I (EP1C12) |
| Logic Elements (LEs) | — | 12,060 |
| Total RAM Bits | — | 239,616 |
| Embedded Multipliers (18x18) | — | 52 |
| User I/O Pins | — | 185 |
| Number of I/O Banks | — | 4 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V to 3.3 V (bank-dependent) |
| Configuration Mode | — | PS / AS / JTAG |
| RoHS-Status | — | [DATA_NEEDED: confirm from product page] |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: confirm] |
| MSL-Level | — | [DATA_NEEDED: confirm] |