EP1C12F256C6 vs EP1C6F256C6 Vergleich
Detaillierter Direktvergleich von EP1C12F256C6 von Intel und EP1C6F256C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C12F256C6 | EP1C6F256C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $48,29 | $38,90 |
| Series | Cyclone I | — |
| Logic Elements | 12,060 | 5,980 |
| Logic Array Blocks (LABs) | 1,206 | 598 |
| Embedded RAM Bits | 239,616 bits (52 M4K blocks) | — |
| Embedded 18x18 Multipliers | 17 | — |
| Maximum User I/Os | 185 | — |
| PLLs | 2 | 2 |
| Process Technology | 130 nm SRAM, 1.5 V core | 0.13 µm SRAM |
| Gehäuse | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA (FBGA) |
| Betriebstemperatur | 0C to +85C (commercial, C6 speed grade) | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 (mid-tier) | C6 |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI | — |
| LVDS Data Rate | Up to 640 Mbps | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone |
| Total RAM Bits | — | 92,160 |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: embedded multiplier count] |
| User I/O Pins | — | 185 |
| Core Voltage | — | 1.5 V |
| Package Dimensions | — | 17 mm × 17 mm |
| Configuration Method | — | JTAG, serial (EPCS), passive serial |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance status] |