EP1C12F256C6 vs EP1C6F256C6 Comparación
Comparación detallada lado a lado de EP1C12F256C6 por Intel y EP1C6F256C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C12F256C6 | EP1C6F256C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $48,29 | $38,90 |
| Series | Cyclone I | — |
| Logic Elements | 12,060 | 5,980 |
| Logic Array Blocks (LABs) | 1,206 | 598 |
| Embedded RAM Bits | 239,616 bits (52 M4K blocks) | — |
| Embedded 18x18 Multipliers | 17 | — |
| Maximum User I/Os | 185 | — |
| PLLs | 2 | 2 |
| Process Technology | 130 nm SRAM, 1.5 V core | 0.13 µm SRAM |
| Encapsulado | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-ball FineLine BGA (FBGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial, C6 speed grade) | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 (mid-tier) | C6 |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI | — |
| LVDS Data Rate | Up to 640 Mbps | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone |
| Total RAM Bits | — | 92,160 |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: embedded multiplier count] |
| User I/O Pins | — | 185 |
| Core Voltage | — | 1.5 V |
| Package Dimensions | — | 17 mm × 17 mm |
| Configuration Method | — | JTAG, serial (EPCS), passive serial |
| Estado RoHS | — | [DATA_NEEDED: RoHS compliance status] |