EP1C4F324C7N vs EP1C3T144C7N Vergleich
Detaillierter Direktvergleich von EP1C4F324C7N von Intel und EP1C3T144C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C4F324C7N | EP1C3T144C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,75 | $16,20 |
| Device Family | Cyclone | — |
| Logic Elements | 4000 | — |
| Logic Array Blocks / CLBs | 249 LABs | — |
| Total RAM Bits | 78336 bits (~9.6 KB) | — |
| Maximum User I/Os | 249 | — |
| PLLs | 2 | 1 |
| Package Type | FBGA-324 (FineLine BGA) | — |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 0.13 um SRAM-based CMOS | 130 nm |
| Speed Grade | C7 (commercial, mid-speed) | 7 |
| Internal Frequency (max) | 405 MHz | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| RoHS-Status | Compliant (lead-free FBGA) | Compliant |
| Montageart | Surface Mount | Surface Mount |
| Series | — | Cyclone® |
| Family | — | Cyclone I |
| Logic Elements (LEs) | — | 2,910 |
| Embedded RAM Bits | — | 59,904 |
| Logic Array Blocks (LABs) | — | 291 |
| User I/Os | — | 104 |
| Core Voltage | — | 1.5 V |
| Gehäuse | — | 144-LQFP (T144) |
| Lead Pitch | — | 1.0 mm |
| MSL-Level | — | [DATA_NEEDED: MSL Level] |